Specific Process Knowledge/Back-end processing - Revision history

Mmat: /* Choose an equipment */

2025-07-03T14:53:29Z

Choose an equipment

← Older revision		Revision as of 16:53, 3 July 2025
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	**[[/Wire Bonder#Ball Wire Bonder K&S 4524\|Ball Wire Bonder]]		**[[/Wire Bonder#Ball Wire Bonder K&S 4524\|Ball Wire Bonder]]
	<br>		<br>
	*Wafer ~~dicing/machining~~		*Wafer Dicing and Machining
	**[[/Polisher CMP\|Polisher CMP - located in the cleanroom]]		**[[/Polisher CMP\|Polisher CMP - located in the cleanroom]]
	**[[/Polishing machine\|Polisher/Lapper machine]]		**[[/Polishing machine\|Polisher/Lapper machine]]
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	**[[/FlipScribe\|FlipScribe]]		**[[/FlipScribe\|FlipScribe]]
	**[[/FlexScribe\|FlexScribe]]		**[[/FlexScribe\|FlexScribe]]
	**~~[[/~~Wafer Scriber~~\|Wafer Scriber]]~~		**Wafer Scriber
	**[[/Disco Saw\|Dicing Saw Disco DAD 321 (old saw)]]		**[[/Disco Saw\|Dicing Saw Disco DAD 321 (old saw)]]
	**[[/Disco Saw\|Dicing Saw Disco DAD 3241 (new saw 2021)]]		**[[/Disco Saw\|Dicing Saw Disco DAD 3241 (new saw 2021)]]

Mmat: /* Back-end processing */

2025-07-03T14:49:45Z

Back-end processing

← Older revision		Revision as of 16:49, 3 July 2025
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	! '''Note! The SupportLab (former Packlab) has been established and tools are currently relocated.'''		! '''Note! The SupportLab (former Packlab) has been established and tools are currently relocated.'''
	<br>		<br>
	Please note that the training on machines requires the "~~Introductino~~ course for Nanolab facilities (not cleanroom)" with specialization to "Access to building 347". Please ask our staff for more information.		Please note that the training on machines requires the "Introduction course for Nanolab facilities (not cleanroom)" with specialization to "Access to building 347". Please ask our staff for more information.
	\|-		\|-
	\|}		\|}

Mmat: /* Back-end processing */

2025-06-17T15:56:47Z

Back-end processing

← Older revision		Revision as of 17:56, 17 June 2025
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	<BR>		<BR>
	<BR>		<BR>
	{\| ~~{{table}~~ style="background:LightGray"}		{\|style="background:LightGray"}
	! '''Note! Packlab is currently ~~under re-construction and planned to re-open in Q2 2025~~.'''		! '''Note! The SupportLab (former Packlab) has been established and tools are currently relocated.'''
	\|-		<br>
	~~\| Some of~~ the ~~tools will find new temporary locations in~~ building ~~346 or building 451~~. Please ask our staff for more information.		Please note that the training on machines requires the "Introductino course for Nanolab facilities (not cleanroom)" with specialization to "Access to building 347". Please ask our staff for more information.
	\|-		\|-
	\|}		\|}

	<br clear="all">		<br clear="all">
	Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.		Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.
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	* Chip/die mounting		* Chip/die mounting
	**[[/Die Bonder\|Die Bonder (eutectic metal)]] ~~[[Image:section under construction.jpg\|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.'''~~		**[[/Die Bonder\|Die Bonder (eutectic metal)]]
			<br>
	*Wire bonding		*Wire bonding
	**[[/Wire Bonder\|TPT Wire Bonder]] ~~[[Image:section under construction.jpg\|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.'''~~		**[[/Wire Bonder\|TPT Wire Bonder]]
	**[[/Wire Bonder#Ball Wire Bonder K&S 4524\|Ball Wire Bonder]]		**[[/Wire Bonder#Ball Wire Bonder K&S 4524\|Ball Wire Bonder]]
			<br>
	*Wafer dicing/machining		*Wafer dicing/machining
	**[[/Polisher CMP\|Polisher CMP - located in the cleanroom]]		**[[/Polisher CMP\|Polisher CMP - located in the cleanroom]]
	**[[/Polishing machine\|Polisher/Lapper machine]] ~~!! Machine decommissioned end of 2024 !!~~		**[[/Polishing machine\|Polisher/Lapper machine]]
	**[[/LatticeAxe\|LatticeAxe]]		**[[/LatticeAxe\|LatticeAxe]]
	**[[/FlipScribe\|FlipScribe]]		**[[/FlipScribe\|FlipScribe]]
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	**[[/Disco Saw\|Wafer cleaner DCS 1441 (post dicing)]]		**[[/Disco Saw\|Wafer cleaner DCS 1441 (post dicing)]]
	**[[/Laser Micromachining Tool\|Laser Micromachining Tool]]		**[[/Laser Micromachining Tool\|Laser Micromachining Tool]]
			<br>
			*Pick & place
			**[[/Micro transfer printer\|Micro transfer printer]]

	<!--		<!--
	* X-ray inspection system		* X-ray inspection system
	**[[/Focal Spot X-ray system\|X-ray Focal Spot inspection system]]		**[[/Focal Spot X-ray system\|X-ray Focal Spot inspection system]]
	-->		-->
	*Pick & place
	**[[/Micro transfer printer\|Micro transfer printer]]

	== Choose processing method ==		== Choose processing method ==
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	*[[/Polishing machine\|Polisher/Lapper machine]]		*[[/Polishing machine\|Polisher/Lapper machine]]
	\|style="background: LightGray"\|		\|style="background: LightGray"\|
	*~~[[/~~Wafer Scriber~~\|Wafer Scriber]]~~		*Diamond Pen (Wafer Scriber)
	*[[/LatticeAxe\|LatticeAxe]]		*[[/LatticeAxe\|LatticeAxe]]
	*[[/FlipScribe\|FlipScribe]]		*[[/FlipScribe\|FlipScribe]]

Mmat at 13:01, 14 May 2025

2025-05-14T13:01:54Z

← Older revision		Revision as of 15:01, 14 May 2025
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	**[[/Disco Saw\|Wafer cleaner DCS 1441 (post dicing)]]		**[[/Disco Saw\|Wafer cleaner DCS 1441 (post dicing)]]
	**[[/Laser Micromachining Tool\|Laser Micromachining Tool]]		**[[/Laser Micromachining Tool\|Laser Micromachining Tool]]
	*Molding
	**[[/Polymer Injection Molder\|Polymer Injection Molder]] !! Machine now owned and moved to DTU Construct !!
	**[[/Hot Embosser\|Hot Embosser]]
	<!--		<!--
	* X-ray inspection system		* X-ray inspection system

Mmat at 13:01, 14 May 2025

2025-05-14T13:01:05Z

← Older revision		Revision as of 15:01, 14 May 2025
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	== Choose an equipment ==		== Choose an equipment ==

	* Stylus profilometer measurements
	**[[Specific Process Knowledge/Characterization/Profiler#Stylus_Profiler:_Dektak150\|Stylus Profiler:Dektak150]]
	* Chip/die mounting		* Chip/die mounting
	**[[/Die Bonder\|Die Bonder (eutectic metal)]] [[Image:section under construction.jpg\|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.'''		**[[/Die Bonder\|Die Bonder (eutectic metal)]] [[Image:section under construction.jpg\|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.'''

Mmat at 16:13, 3 May 2025

2025-05-03T16:13:26Z

← Older revision		Revision as of 18:13, 3 May 2025
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	{{cc-nanolab}}		{{cc-nanolab}}

	~~<!-- Under construction [[Image:section under construction.jpg\|70px]] -->~~
	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''

Mmat at 13:03, 6 March 2025

2025-03-06T13:03:46Z

← Older revision		Revision as of 15:03, 6 March 2025
Line 4:		Line 4:
	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''


			=Back-end processing=

	Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.		Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

Mmat at 15:23, 13 February 2025

2025-02-13T15:23:59Z

← Older revision		Revision as of 17:23, 13 February 2025
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	These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.		These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
			<BR>
	~~[[Image:section under construction.jpg\|70px\|left]]~~		<BR>
	{\| {{table} style="background:LightGray"}		{\| {{table} style="background:LightGray"}
	! '''Note! Packlab ~~will be closed from February/March 2023~~ to Q2 ~~2024 due to the construction of our new PolyFabLab~~.'''		! '''Note! Packlab is currently under re-construction and planned to re-open in Q2 2025.'''
	\|-		\|-
	\| Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.		\| Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.

Mmat at 15:22, 13 February 2025

2025-02-13T15:22:28Z

← Older revision		Revision as of 17:22, 13 February 2025
Line 9:		Line 9:
	These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.		These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.

			[[Image:section under construction.jpg\|70px\|left]]
	{\| {{table} style="background:LightGray"}		{\| {{table} style="background:LightGray"}
	! '''Note! Packlab ~~is currently under re-construction and expected~~ to ~~re-open~~ Q2~~/2025~~.'''		! '''Note! Packlab will be closed from February/March 2023 to Q2 2024 due to the construction of our new PolyFabLab.'''
	\|-		\|-
	\| Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.		\| Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.

Mmat at 15:22, 13 February 2025

2025-02-13T15:22:24Z

← Older revision		Revision as of 17:22, 13 February 2025
Line 9:		Line 9:
	These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.		These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.

	~~[[Image:section under construction.jpg\|70px\|left]]~~
	{\| {{table} style="background:LightGray"}		{\| {{table} style="background:LightGray"}
	! '''Note! Packlab ~~will be closed from February/March 2023~~ to Q2 ~~2024 due to the construction of our new PolyFabLab~~.'''		! '''Note! Packlab is currently under re-construction and expected to re-open Q2/2025.'''
	\|-		\|-
	\| Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.		\| Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.

← Older revision		Revision as of 16:53, 3 July 2025
Line 29:		Line 29:
	**[[/Wire Bonder#Ball Wire Bonder K&S 4524\|Ball Wire Bonder]]		**[[/Wire Bonder#Ball Wire Bonder K&S 4524\|Ball Wire Bonder]]
	<br>		<br>
	*Wafer ~~dicing/machining~~		*Wafer Dicing and Machining
	**[[/Polisher CMP\|Polisher CMP - located in the cleanroom]]		**[[/Polisher CMP\|Polisher CMP - located in the cleanroom]]
	**[[/Polishing machine\|Polisher/Lapper machine]]		**[[/Polishing machine\|Polisher/Lapper machine]]
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	**[[/FlipScribe\|FlipScribe]]		**[[/FlipScribe\|FlipScribe]]
	**[[/FlexScribe\|FlexScribe]]		**[[/FlexScribe\|FlexScribe]]
	**~~[[/~~Wafer Scriber~~\|Wafer Scriber]]~~		**Wafer Scriber
	**[[/Disco Saw\|Dicing Saw Disco DAD 321 (old saw)]]		**[[/Disco Saw\|Dicing Saw Disco DAD 321 (old saw)]]
	**[[/Disco Saw\|Dicing Saw Disco DAD 3241 (new saw 2021)]]		**[[/Disco Saw\|Dicing Saw Disco DAD 3241 (new saw 2021)]]