LabAdviser/Technology Research - Revision history

Mmat: /* Completed 3 week projects */

2025-05-27T16:11:06Z

Completed 3 week projects

Mmat at 13:35, 23 May 2025

2025-05-23T13:35:12Z

← Older revision		Revision as of 15:35, 23 May 2025
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	Current project descriptions of projects going on at DTU Nanolab can be found on our home page. Overview of research topics can be found here: [https://www.nanolab.dtu.dk/research DTU Nanolab research] and list of Ph.d. students/projects can be found here: [https://www.nanolab.dtu.dk/education/phd-school/phds-at-nanolab PhD's at DTU Nanolab].		Current project descriptions of projects going on at DTU Nanolab can be found on our home page. Overview of research topics can be found here: [https://www.nanolab.dtu.dk/research DTU Nanolab research] and list of Ph.d. students/projects can be found here: [https://www.nanolab.dtu.dk/education/phd-school/phds-at-nanolab PhD's at DTU Nanolab].

	The original aim of this page was to give an overview of the technology research going on in the cleanroom and the other laboratories facilitated by DTU Nanolab. That included a project description and links to other pages in LabAdviser where the process development outcome from these projects can be found. There are a few projects described here but at the moment this is not being ~~fully~~ updated. Please take a look at our home page to get information about current projects.		The original aim of this page was to give an overview of the technology research going on in the cleanroom and the other laboratories facilitated by DTU Nanolab. That included a project description and links to other pages in LabAdviser where the process development outcome from these projects can be found. '''There are a few projects described here but at the moment this is not being updated.''' Please take a look at our home page to get information about current projects.
	<!-- [[image:Technology Research.jpg\|right\|400px]] -->		<!-- [[image:Technology Research.jpg\|right\|400px]] -->

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	grain structure in the beryllium lenses have become a source of degradation of the coherence of		grain structure in the beryllium lenses have become a source of degradation of the coherence of
	the beam.		the beam.
	\|\|[[Media:Diamant2018_v5.pdf]]		\|\|[[index.php?title=Media:Diamant2018 v5.pdf\|Media:Diamant2018_v5.pdf]]
	\|3D laser micro machining, laser milling, diamond, x-ray, lens, CRL		\|3D laser micro machining, laser milling, diamond, x-ray, lens, CRL
	\|-		\|-
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	experiments designed to create a surface response model for each of the materials tested. This		experiments designed to create a surface response model for each of the materials tested. This
	project will also cover what methods are ideal to use for measuring the thickness of a deposition.		project will also cover what methods are ideal to use for measuring the thickness of a deposition.
	\|\|[[Media:Lesker_rapport_3w_july_2018.pdf‎ ]]		\|\|[[index.php?title=Media:Lesker rapport 3w july 2018.pdf\|Media:Lesker_rapport_3w_july_2018.pdf‎]]
	\|sputtering, lesker, thin film, characterization, ...		\|sputtering, lesker, thin film, characterization, ...
	\|-		\|-
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	\|		\|
	The purpose of the project is optimize the lithography process on Si/SiO2 wafers to obtain straight sidewalls for dry plasma etching. In the project we experience adhesion problems and undercut of the resist at the interface to the sample. Several tests were performed in order to overcome this problem.		The purpose of the project is optimize the lithography process on Si/SiO2 wafers to obtain straight sidewalls for dry plasma etching. In the project we experience adhesion problems and undercut of the resist at the interface to the sample. Several tests were performed in order to overcome this problem.
	\|\|[[Media:New_3_Week_Course.pdf]]		\|\|[[index.php?title=Media:New 3 Week Course.pdf\|Media:New_3_Week_Course.pdf]]
	\|UV lithography		\|UV lithography
	\|-		\|-
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	AlN has been deposited on wafers, and the best recipe have been chosen for deposition on samples with high aspect ratio trenches.		AlN has been deposited on wafers, and the best recipe have been chosen for deposition on samples with high aspect ratio trenches.
	To limit the amount of depositions the design of experiment (DOE) software JMP has been used to select a number of different recipe parameters. JMP has also been used to evaluate the results.		To limit the amount of depositions the design of experiment (DOE) software JMP has been used to select a number of different recipe parameters. JMP has also been used to evaluate the results.
	\|\|[[Media:33470-Mikro3W-Journal.pdf\|PEALD deposition of AlN using TMA and NH3]]		\|\|[[index.php?title=Media:33470-Mikro3W-Journal.pdf\|PEALD deposition of AlN using TMA and NH3]]
	\|PEALD, AlN, DOE, characterization		\|PEALD, AlN, DOE, characterization

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	\|		\|
	In this 3-weeks course, the student will be working on the micro-fabrication of a Silicon/Gold grating for X-Ray optics. The fabrication of these devices require the usage of standard UV lithography combine with DRIE of silicon and metal thermal evaporation. The optimized DRIE Bosch process creates a fluorocarbon (FC) layer deposited homogeneously along the sidewall of the trench. While the depth of the trench increases with the dry etch number of cycles, an FC layer is accumulating at the top of the trench. This protrusion allows for shadow masking the sidewalls during thermal evaporation of gold, in order to deposit a seed layer at the bottom of the trench allowing for subsequent metallization by electroplating. The student will be designing a simple mask using the software CleWin. The mask will be pattern on a UV resist (5214E) using the Maskless aligner available at DTU Danchip. They will also calculate how deep the trench should be to get a minimum absorption of 92% of the intensity of the X-Ray energy.		In this 3-weeks course, the student will be working on the micro-fabrication of a Silicon/Gold grating for X-Ray optics. The fabrication of these devices require the usage of standard UV lithography combine with DRIE of silicon and metal thermal evaporation. The optimized DRIE Bosch process creates a fluorocarbon (FC) layer deposited homogeneously along the sidewall of the trench. While the depth of the trench increases with the dry etch number of cycles, an FC layer is accumulating at the top of the trench. This protrusion allows for shadow masking the sidewalls during thermal evaporation of gold, in order to deposit a seed layer at the bottom of the trench allowing for subsequent metallization by electroplating. The student will be designing a simple mask using the software CleWin. The mask will be pattern on a UV resist (5214E) using the Maskless aligner available at DTU Danchip. They will also calculate how deep the trench should be to get a minimum absorption of 92% of the intensity of the X-Ray energy.
	\|\|[[Media:~~Micro_fabrication_of_x_ray_optics_3w_Andreas_Kristin~~.pdf\|Microfabrication of X-Ray optics]]		\|\|[[index.php?title=Media:Micro fabrication of x ray optics 3w Andreas Kristin.pdf\|Microfabrication of X-Ray optics]]
	\|DRIE, Lithography, CleWin, Characterization		\|DRIE, Lithography, CleWin, Characterization
	\|-		\|-
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	Mathias Hoeg Boisen s164000		Mathias Hoeg Boisen s164000
	\|Using the Black Silicon Method to Monitor the Reproducibility of Plasma Etching Processes		\|Using the Black Silicon Method to Monitor the Reproducibility of Plasma Etching Processes
	\|[[Media:Final ~~report_Black~~ silicon.pdf\|Black silicon]]		\|[[index.php?title=Media:Final report Black silicon.pdf\|Black silicon]]
	\|RIE, Plasma etching, process reproducibility		\|RIE, Plasma etching, process reproducibility
	\|-		\|-
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	Asger Steen Nielsen s150369		Asger Steen Nielsen s150369
	\|Precise Timing Control in Deep Reactive Ion Etching (DRIE) with Bosch Process		\|Precise Timing Control in Deep Reactive Ion Etching (DRIE) with Bosch Process
	\|[[Media:Final ~~report_Etching~~ time control.pdf\|Etching time control]]		\|[[index.php?title=Media:Final report Etching time control.pdf\|Etching time control]]
	\|DRIE, Plasma Etching		\|DRIE, Plasma Etching
	\|-		\|-
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	Mette Bybjerg Brock s134252		Mette Bybjerg Brock s134252
	\|High Resolution Pattern Definition with E-beam Lithography		\|High Resolution Pattern Definition with E-beam Lithography
	\|[[Media:Final ~~report_EBL~~ pattern with HSQ.pdf\|EBL pattern with HSQ]]		\|[[index.php?title=Media:Final report EBL pattern with HSQ.pdf\|EBL pattern with HSQ]]
	\|E-beam lithography		\|E-beam lithography
	\|-		\|-
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	William Band Lomholt s4269		William Band Lomholt s4269
	\|In-situ imaging of the ALD film growth mechanism can be done in an environmental TEM (eTEM), but it is very important to understand if the gas phase reactions can contaminate the microscope. For this reason a small ALD system with a chamber size corresponding to the specimen area of the eTEM has been build. With this chamber ALD depositions of platinum can be studied and optimized. In this project the software LabView has been used to program a Virtual Intstument (VI) that can control the different components of the hardware on the ALD system. With the software it is also possible to define the parameters for an ALD deposition process. The different programming steps are described in details in the report. Furhermore, the ALD deposition principle is described in the report.		\|In-situ imaging of the ALD film growth mechanism can be done in an environmental TEM (eTEM), but it is very important to understand if the gas phase reactions can contaminate the microscope. For this reason a small ALD system with a chamber size corresponding to the specimen area of the eTEM has been build. With this chamber ALD depositions of platinum can be studied and optimized. In this project the software LabView has been used to program a Virtual Intstument (VI) that can control the different components of the hardware on the ALD system. With the software it is also possible to define the parameters for an ALD deposition process. The different programming steps are described in details in the report. Furhermore, the ALD deposition principle is described in the report.
	\|[[:~~media:3week_Jan2016_Gustav_William~~.pdf\|Programming the Control Software of an Atomic Layer Deposition System]]		\|[[index.php?title=Media:3week Jan2016 Gustav William.pdf\|Programming the Control Software of an Atomic Layer Deposition System]]
	\|ALD, LabView		\|ALD, LabView
	\|-		\|-
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	In this project silicon samples with DRIE etched micro trenches have then been annealed in the ATV Furnace and the Black Magic PECVD. The annealing has been done at high temperatures and both at atmospheric pressure and vacuum. Prior to the annealing some of the sample have been RCA cleaned.		In this project silicon samples with DRIE etched micro trenches have then been annealed in the ATV Furnace and the Black Magic PECVD. The annealing has been done at high temperatures and both at atmospheric pressure and vacuum. Prior to the annealing some of the sample have been RCA cleaned.
	To evaluate the effect of the annealing the samples have been inspected using SEM.		To evaluate the effect of the annealing the samples have been inspected using SEM.
	\|[[~~:media~~:Hydrogen Annealing for Removal of Scallops after DRIE.pdf\|Hydrogen Annealing for Removal of Scallops after DRIE]]		\|[[index.php?title=Media:Hydrogen Annealing for Removal of Scallops after DRIE.pdf\|Hydrogen Annealing for Removal of Scallops after DRIE]]
	\|DRIE, scallops, hydrogen annealing		\|DRIE, scallops, hydrogen annealing
	\|-		\|-
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	\|Zakaria Abachri (s134237) <br> Rune Sixten Grass (s134243)		\|Zakaria Abachri (s134237) <br> Rune Sixten Grass (s134243)
	\|The purpose of this project and following journal is to characterise the material thickness produced using parameters such as pressure, power and ratio of source materials used in magnetron sputtering of silicon wafers on the sputter system in DTU Danschips cleanroom. We want to investigate and optimize the sputter deposition process and map how the parameters affects the thickness of different types of metals, dielectrics or semiconductors on silicon wafers. The thickness will be measured in-situ by an ellipsometer layer by layer by fitting different types of material models to the data, which in turn predict the growth rate for each layer. An ex-situ measurement of the total multilayer thickness will also be carried out as a comparison to the model fit.		\|The purpose of this project and following journal is to characterise the material thickness produced using parameters such as pressure, power and ratio of source materials used in magnetron sputtering of silicon wafers on the sputter system in DTU Danschips cleanroom. We want to investigate and optimize the sputter deposition process and map how the parameters affects the thickness of different types of metals, dielectrics or semiconductors on silicon wafers. The thickness will be measured in-situ by an ellipsometer layer by layer by fitting different types of material models to the data, which in turn predict the growth rate for each layer. An ex-situ measurement of the total multilayer thickness will also be carried out as a comparison to the model fit.
	\|[[Media:~~3_weeks_course_Zakaria_Abachri_~~(s134237)~~_Rune_Sixten_Grass_~~(s134243).~~pdf‎~~ \|Optimization of thin film deposition using in-situ ellipsometry]]		\|[[index.php?title=Media:3 weeks course Zakaria Abachri (s134237) Rune Sixten Grass (s134243).pdf\|Optimization of thin film deposition using in-situ ellipsometry]]
	\|ellipsometry, thin film, in-situ, sputtering, lesker		\|ellipsometry, thin film, in-situ, sputtering, lesker
	\|-		\|-
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	\|Jens Hemmingsen s135101		\|Jens Hemmingsen s135101
	\|Laser ablation is a method used to remove material from a solid surface, by irradiating it with a laser beam. The material directly underneath the beam is heated and then evaporates. The process can be compared to old fashioned machine milling, in which a rotary tool is used to remove material from a solid surface, and indeed laser ablation is also known as laser micromachining. There are a lot of different, sometimes interdependent, process parameters used in the milling process, which means that the ablation removal rate often depends on the specific design pattern used in a particular job. The goal of this project is to reduce the need for design-specific process optimization or to find ways to simplify the process optimization.		\|Laser ablation is a method used to remove material from a solid surface, by irradiating it with a laser beam. The material directly underneath the beam is heated and then evaporates. The process can be compared to old fashioned machine milling, in which a rotary tool is used to remove material from a solid surface, and indeed laser ablation is also known as laser micromachining. There are a lot of different, sometimes interdependent, process parameters used in the milling process, which means that the ablation removal rate often depends on the specific design pattern used in a particular job. The goal of this project is to reduce the need for design-specific process optimization or to find ways to simplify the process optimization.
	\|[[~~:media~~:3-~~weeks_course_~~-~~_Jens_Hemmingsen_~~-~~_micro~~-~~3W_laser_micromachining~~.pdf\|Laser micromachining of silicon microstructures]]		\|[[index.php?title=Media:3-weeks course - Jens Hemmingsen - micro-3W laser micromachining.pdf\|Laser micromachining of silicon microstructures]]
	\|laser micro machining, silicon, dicing		\|laser micro machining, silicon, dicing
	\|-		\|-
	\|}		\|}

Mmat at 13:41, 12 February 2025

2025-02-12T13:41:24Z

← Older revision		Revision as of 15:41, 12 February 2025
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			{{cc-nanolab}}

	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/LabAdviser/Technology_Research click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/LabAdviser/Technology_Research click here]'''

	~~<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>~~

Bghe at 11:53, 4 January 2024

2024-01-04T11:53:34Z

← Older revision		Revision as of 13:53, 4 January 2024
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	If you perform technology research in the DTU Nanolab facilities and you would like to contribute to this overview page then please start by contacting [mailto:labadviser@nanolab.dtu.dk?Subject=I%20would%20like%20to%20present%20my%20technology%20research&body=Dear%20Berit,%0A%0DFree%20text...%0A%0DOr%20your%20call%20me:%2045256303 Berit Herstrøm].		If you perform technology research in the DTU Nanolab facilities and you would like to contribute to this overview page then please start by contacting [mailto:labadviser@nanolab.dtu.dk?Subject=I%20would%20like%20to%20present%20my%20technology%20research&body=Dear%20Berit,%0A%0DFree%20text...%0A%0DOr%20your%20call%20me:%2045256303 Berit Herstrøm].

	In the bottom of the page some student 3-weeks project reports are ~~listet~~ and ~~upload~~. More project reports are welcome.		In the bottom of the page some student 3-weeks project reports are listed and uploaded. More project reports are welcome.
	<br clear="all"/>		<br clear="all"/>

Bghe at 11:52, 4 January 2024

2024-01-04T11:52:35Z

← Older revision		Revision as of 13:52, 4 January 2024
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	*[[/Presentation Form\|Presentation Form]]		*[[/Presentation Form\|Presentation Form]]

	If you perform technology research in the DTU Nanolab facilities and you would like to contribute to this overview page then please start by contacting [mailto:labadviser@~~danchip~~.dtu.dk?Subject=I%20would%20like%20to%20present%20my%20technology%20research&body=Dear%20Berit,%0A%0DFree%20text...%0A%0DOr%20your%20call%20me:%2045256303 Berit Herstrøm].		If you perform technology research in the DTU Nanolab facilities and you would like to contribute to this overview page then please start by contacting [mailto:labadviser@nanolab.dtu.dk?Subject=I%20would%20like%20to%20present%20my%20technology%20research&body=Dear%20Berit,%0A%0DFree%20text...%0A%0DOr%20your%20call%20me:%2045256303 Berit Herstrøm].

			In the bottom of the page some student 3-weeks project reports are listet and upload. More project reports are welcome.
	<br clear="all"/>		<br clear="all"/>

Bghe at 11:50, 4 January 2024

2024-01-04T11:50:06Z

← Older revision		Revision as of 13:50, 4 January 2024
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	[[image:Final1.jpg\|right\|500px\|thumb\|Image: DTU internal]]		[[image:Final1.jpg\|right\|500px\|thumb\|Image: DTU internal]]
	Current project descriptions of projects going on at DTU Nanolab can be found on our home page. Overview of research topics can be found here: [https://www.nanolab.dtu.dk/research] and list of Ph.d. students/projects can be found here: [https://www.nanolab.dtu.dk/education/phd-school/phds-at-nanolab].		Current project descriptions of projects going on at DTU Nanolab can be found on our home page. Overview of research topics can be found here: [https://www.nanolab.dtu.dk/research DTU Nanolab research] and list of Ph.d. students/projects can be found here: [https://www.nanolab.dtu.dk/education/phd-school/phds-at-nanolab PhD's at DTU Nanolab].

	The original aim of this page was to give an overview of the technology research going on in the cleanroom and the other laboratories facilitated by DTU Nanolab. That included a project description and links to other pages in LabAdviser where the process development outcome from these projects can be found. There are a few projects described here but at the moment this is not being fully updated. Please take a look at our home page to get information about current projects.		The original aim of this page was to give an overview of the technology research going on in the cleanroom and the other laboratories facilitated by DTU Nanolab. That included a project description and links to other pages in LabAdviser where the process development outcome from these projects can be found. There are a few projects described here but at the moment this is not being fully updated. Please take a look at our home page to get information about current projects.
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	*[[/Presentation Form\|Presentation Form]]		*[[/Presentation Form\|Presentation Form]]

	If you perform technology research in the DTU Nanolab facilities and you would like to contribute to this overview page~~. Start~~ by contacting [mailto:labadviser@danchip.dtu.dk?Subject=I%20would%20like%20to%20present%20my%20technology%20research&body=Dear%20Berit,%0A%0DFree%20text...%0A%0DOr%20your%20call%20me:%2045256303 Berit Herstrøm].		If you perform technology research in the DTU Nanolab facilities and you would like to contribute to this overview page then please start by contacting [mailto:labadviser@danchip.dtu.dk?Subject=I%20would%20like%20to%20present%20my%20technology%20research&body=Dear%20Berit,%0A%0DFree%20text...%0A%0DOr%20your%20call%20me:%2045256303 Berit Herstrøm].
	<br clear="all"/>		<br clear="all"/>

Bghe at 11:47, 4 January 2024

2024-01-04T11:47:53Z

← Older revision		Revision as of 13:47, 4 January 2024
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	Current project descriptions of projects going on at DTU Nanolab can be found on our home page. Overview of research topics can be found here: [https://www.nanolab.dtu.dk/research] and list of Ph.d. students/projects can be found here: [https://www.nanolab.dtu.dk/education/phd-school/phds-at-nanolab].		Current project descriptions of projects going on at DTU Nanolab can be found on our home page. Overview of research topics can be found here: [https://www.nanolab.dtu.dk/research] and list of Ph.d. students/projects can be found here: [https://www.nanolab.dtu.dk/education/phd-school/phds-at-nanolab].

	The original aim of this page was to give an overview of the technology research going on in the cleanroom and the other laboratories facilitated by DTU Nanolab. That included a project description and links to other pages in LabAdviser where the process development outcome from these projects can be found. There are a few projects ~~describes~~ here but at the moment this is not being updated. Please take a look at our home page to get information about current projects.		The original aim of this page was to give an overview of the technology research going on in the cleanroom and the other laboratories facilitated by DTU Nanolab. That included a project description and links to other pages in LabAdviser where the process development outcome from these projects can be found. There are a few projects described here but at the moment this is not being fully updated. Please take a look at our home page to get information about current projects.
	<!-- [[image:Technology Research.jpg\|right\|400px]] -->		<!-- [[image:Technology Research.jpg\|right\|400px]] -->

Bghe at 11:46, 4 January 2024

2024-01-04T11:46:38Z

← Older revision		Revision as of 13:46, 4 January 2024
Line 6:		Line 6:

	[[image:Final1.jpg\|right\|500px\|thumb\|Image: DTU internal]]		[[image:Final1.jpg\|right\|500px\|thumb\|Image: DTU internal]]
	Current project descriptions of ~~project~~ going on at DTU Nanolab can be found on our home page. Overview of research topics can be found here: [https://www.nanolab.dtu.dk/research] and list of Ph.d. students/projects can be found here: [https://www.nanolab.dtu.dk/education/phd-school/phds-at-nanolab].		Current project descriptions of projects going on at DTU Nanolab can be found on our home page. Overview of research topics can be found here: [https://www.nanolab.dtu.dk/research] and list of Ph.d. students/projects can be found here: [https://www.nanolab.dtu.dk/education/phd-school/phds-at-nanolab].

	The original aim of this page was to give an overview of the technology research going on in the cleanroom and the other laboratories facilitated by DTU Nanolab. That included a project description and links to other pages in LabAdviser where the process development outcome from these projects can be found. There are a few projects describes here but at the moment this is not being updated. Please take a look at our home page to get information about current projects.		The original aim of this page was to give an overview of the technology research going on in the cleanroom and the other laboratories facilitated by DTU Nanolab. That included a project description and links to other pages in LabAdviser where the process development outcome from these projects can be found. There are a few projects describes here but at the moment this is not being updated. Please take a look at our home page to get information about current projects.

Bghe at 11:46, 4 January 2024

2024-01-04T11:46:04Z

← Older revision		Revision as of 13:46, 4 January 2024
Line 6:		Line 6:

	[[image:Final1.jpg\|right\|500px\|thumb\|Image: DTU internal]]		[[image:Final1.jpg\|right\|500px\|thumb\|Image: DTU internal]]
	Current project descriptions of project going on at DTU Nanolab can be found on our home page. Ph.d. ~~project~~ here: [https://www.nanolab.dtu.dk/education/phd-school/phds-at-nanolab]. The original aim of this page was to give an overview of the technology research going on in the cleanroom and the other laboratories facilitated by DTU Nanolab. That included a project description and links to other pages in LabAdviser where the process development outcome from these projects can be found. There are a few projects describes here but at the moment this is not being updated. Please take a look at our home page to get information about current projects.		Current project descriptions of project going on at DTU Nanolab can be found on our home page. Overview of research topics can be found here: [https://www.nanolab.dtu.dk/research] and list of Ph.d. students/projects can be found here: [https://www.nanolab.dtu.dk/education/phd-school/phds-at-nanolab].

			The original aim of this page was to give an overview of the technology research going on in the cleanroom and the other laboratories facilitated by DTU Nanolab. That included a project description and links to other pages in LabAdviser where the process development outcome from these projects can be found. There are a few projects describes here but at the moment this is not being updated. Please take a look at our home page to get information about current projects.
	<!-- [[image:Technology Research.jpg\|right\|400px]] -->		<!-- [[image:Technology Research.jpg\|right\|400px]] -->

Bghe at 11:42, 4 January 2024

2024-01-04T11:42:38Z

← Older revision		Revision as of 13:42, 4 January 2024
Line 12:		Line 12:
	*[[/Presentation Form\|Presentation Form]]		*[[/Presentation Form\|Presentation Form]]

	If you perform technology research in the DTU Nanolab facilities~~, please~~ contribute to this overview page. Start by contacting [mailto:labadviser@danchip.dtu.dk?Subject=I%20would%20like%20to%20present%20my%20technology%20research&body=Dear%20Berit,%0A%0DFree%20text...%0A%0DOr%20your%20call%20me:%2045256303 Berit Herstrøm].		If you perform technology research in the DTU Nanolab facilities and you would like to contribute to this overview page. Start by contacting [mailto:labadviser@danchip.dtu.dk?Subject=I%20would%20like%20to%20present%20my%20technology%20research&body=Dear%20Berit,%0A%0DFree%20text...%0A%0DOr%20your%20call%20me:%2045256303 Berit Herstrøm].
	<br clear="all"/>		<br clear="all"/>

← Older revision		Revision as of 18:11, 27 May 2025
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	grain structure in the beryllium lenses have become a source of degradation of the coherence of		grain structure in the beryllium lenses have become a source of degradation of the coherence of
	the beam.		the beam.
	\|\|[[~~index.php?title=~~Media:Diamant2018 v5.pdf\|Media:Diamant2018_v5.pdf]]		\|\|[[Media:Diamant2018 v5.pdf\|Media:Diamant2018_v5.pdf]]
	\|3D laser micro machining, laser milling, diamond, x-ray, lens, CRL		\|3D laser micro machining, laser milling, diamond, x-ray, lens, CRL
	\|-		\|-
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	experiments designed to create a surface response model for each of the materials tested. This		experiments designed to create a surface response model for each of the materials tested. This
	project will also cover what methods are ideal to use for measuring the thickness of a deposition.		project will also cover what methods are ideal to use for measuring the thickness of a deposition.
	\|\|[[~~index.php?title=~~Media:Lesker rapport 3w july 2018.pdf\|Media:Lesker_rapport_3w_july_2018.pdf‎]]		\|\|[[Media:Lesker rapport 3w july 2018.pdf\|Media:Lesker_rapport_3w_july_2018.pdf‎]]
	\|sputtering, lesker, thin film, characterization, ...		\|sputtering, lesker, thin film, characterization, ...
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	The purpose of the project is optimize the lithography process on Si/SiO2 wafers to obtain straight sidewalls for dry plasma etching. In the project we experience adhesion problems and undercut of the resist at the interface to the sample. Several tests were performed in order to overcome this problem.		The purpose of the project is optimize the lithography process on Si/SiO2 wafers to obtain straight sidewalls for dry plasma etching. In the project we experience adhesion problems and undercut of the resist at the interface to the sample. Several tests were performed in order to overcome this problem.
	\|\|[[~~index.php?title=~~Media:New 3 Week Course.pdf\|Media:New_3_Week_Course.pdf]]		\|\|[[Media:New 3 Week Course.pdf\|Media:New_3_Week_Course.pdf]]
	\|UV lithography		\|UV lithography
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	AlN has been deposited on wafers, and the best recipe have been chosen for deposition on samples with high aspect ratio trenches.		AlN has been deposited on wafers, and the best recipe have been chosen for deposition on samples with high aspect ratio trenches.
	To limit the amount of depositions the design of experiment (DOE) software JMP has been used to select a number of different recipe parameters. JMP has also been used to evaluate the results.		To limit the amount of depositions the design of experiment (DOE) software JMP has been used to select a number of different recipe parameters. JMP has also been used to evaluate the results.
	\|\|[[~~index.php?title=~~Media:33470-Mikro3W-Journal.pdf\|PEALD deposition of AlN using TMA and NH3]]		\|\|[[Media:33470-Mikro3W-Journal.pdf\|PEALD deposition of AlN using TMA and NH3]]
	\|PEALD, AlN, DOE, characterization		\|PEALD, AlN, DOE, characterization

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	In this 3-weeks course, the student will be working on the micro-fabrication of a Silicon/Gold grating for X-Ray optics. The fabrication of these devices require the usage of standard UV lithography combine with DRIE of silicon and metal thermal evaporation. The optimized DRIE Bosch process creates a fluorocarbon (FC) layer deposited homogeneously along the sidewall of the trench. While the depth of the trench increases with the dry etch number of cycles, an FC layer is accumulating at the top of the trench. This protrusion allows for shadow masking the sidewalls during thermal evaporation of gold, in order to deposit a seed layer at the bottom of the trench allowing for subsequent metallization by electroplating. The student will be designing a simple mask using the software CleWin. The mask will be pattern on a UV resist (5214E) using the Maskless aligner available at DTU Danchip. They will also calculate how deep the trench should be to get a minimum absorption of 92% of the intensity of the X-Ray energy.		In this 3-weeks course, the student will be working on the micro-fabrication of a Silicon/Gold grating for X-Ray optics. The fabrication of these devices require the usage of standard UV lithography combine with DRIE of silicon and metal thermal evaporation. The optimized DRIE Bosch process creates a fluorocarbon (FC) layer deposited homogeneously along the sidewall of the trench. While the depth of the trench increases with the dry etch number of cycles, an FC layer is accumulating at the top of the trench. This protrusion allows for shadow masking the sidewalls during thermal evaporation of gold, in order to deposit a seed layer at the bottom of the trench allowing for subsequent metallization by electroplating. The student will be designing a simple mask using the software CleWin. The mask will be pattern on a UV resist (5214E) using the Maskless aligner available at DTU Danchip. They will also calculate how deep the trench should be to get a minimum absorption of 92% of the intensity of the X-Ray energy.
	\|\|[[~~index.php?title=~~Media:Micro fabrication of x ray optics 3w Andreas Kristin.pdf\|Microfabrication of X-Ray optics]]		\|\|[[Media:Micro fabrication of x ray optics 3w Andreas Kristin.pdf\|Microfabrication of X-Ray optics]]
	\|DRIE, Lithography, CleWin, Characterization		\|DRIE, Lithography, CleWin, Characterization
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	Mathias Hoeg Boisen s164000		Mathias Hoeg Boisen s164000
	\|Using the Black Silicon Method to Monitor the Reproducibility of Plasma Etching Processes		\|Using the Black Silicon Method to Monitor the Reproducibility of Plasma Etching Processes
	\|[[~~index.php?title=~~Media:Final report Black silicon.pdf\|Black silicon]]		\|[[Media:Final report Black silicon.pdf\|Black silicon]]
	\|RIE, Plasma etching, process reproducibility		\|RIE, Plasma etching, process reproducibility
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	Asger Steen Nielsen s150369		Asger Steen Nielsen s150369
	\|Precise Timing Control in Deep Reactive Ion Etching (DRIE) with Bosch Process		\|Precise Timing Control in Deep Reactive Ion Etching (DRIE) with Bosch Process
	\|[[~~index.php?title=~~Media:Final report Etching time control.pdf\|Etching time control]]		\|[[Media:Final report Etching time control.pdf\|Etching time control]]
	\|DRIE, Plasma Etching		\|DRIE, Plasma Etching
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	Mette Bybjerg Brock s134252		Mette Bybjerg Brock s134252
	\|High Resolution Pattern Definition with E-beam Lithography		\|High Resolution Pattern Definition with E-beam Lithography
	\|[[~~index.php?title=~~Media:Final report EBL pattern with HSQ.pdf\|EBL pattern with HSQ]]		\|[[Media:Final report EBL pattern with HSQ.pdf\|EBL pattern with HSQ]]
	\|E-beam lithography		\|E-beam lithography
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	William Band Lomholt s4269		William Band Lomholt s4269
	\|In-situ imaging of the ALD film growth mechanism can be done in an environmental TEM (eTEM), but it is very important to understand if the gas phase reactions can contaminate the microscope. For this reason a small ALD system with a chamber size corresponding to the specimen area of the eTEM has been build. With this chamber ALD depositions of platinum can be studied and optimized. In this project the software LabView has been used to program a Virtual Intstument (VI) that can control the different components of the hardware on the ALD system. With the software it is also possible to define the parameters for an ALD deposition process. The different programming steps are described in details in the report. Furhermore, the ALD deposition principle is described in the report.		\|In-situ imaging of the ALD film growth mechanism can be done in an environmental TEM (eTEM), but it is very important to understand if the gas phase reactions can contaminate the microscope. For this reason a small ALD system with a chamber size corresponding to the specimen area of the eTEM has been build. With this chamber ALD depositions of platinum can be studied and optimized. In this project the software LabView has been used to program a Virtual Intstument (VI) that can control the different components of the hardware on the ALD system. With the software it is also possible to define the parameters for an ALD deposition process. The different programming steps are described in details in the report. Furhermore, the ALD deposition principle is described in the report.
	\|[[~~index.php?title=~~Media:3week Jan2016 Gustav William.pdf\|Programming the Control Software of an Atomic Layer Deposition System]]		\|[[Media:3week Jan2016 Gustav William.pdf\|Programming the Control Software of an Atomic Layer Deposition System]]
	\|ALD, LabView		\|ALD, LabView
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	In this project silicon samples with DRIE etched micro trenches have then been annealed in the ATV Furnace and the Black Magic PECVD. The annealing has been done at high temperatures and both at atmospheric pressure and vacuum. Prior to the annealing some of the sample have been RCA cleaned.		In this project silicon samples with DRIE etched micro trenches have then been annealed in the ATV Furnace and the Black Magic PECVD. The annealing has been done at high temperatures and both at atmospheric pressure and vacuum. Prior to the annealing some of the sample have been RCA cleaned.
	To evaluate the effect of the annealing the samples have been inspected using SEM.		To evaluate the effect of the annealing the samples have been inspected using SEM.
	\|[[~~index.php?title=~~Media:Hydrogen Annealing for Removal of Scallops after DRIE.pdf\|Hydrogen Annealing for Removal of Scallops after DRIE]]		\|[[Media:Hydrogen Annealing for Removal of Scallops after DRIE.pdf\|Hydrogen Annealing for Removal of Scallops after DRIE]]
	\|DRIE, scallops, hydrogen annealing		\|DRIE, scallops, hydrogen annealing
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	\|Zakaria Abachri (s134237) <br> Rune Sixten Grass (s134243)		\|Zakaria Abachri (s134237) <br> Rune Sixten Grass (s134243)
	\|The purpose of this project and following journal is to characterise the material thickness produced using parameters such as pressure, power and ratio of source materials used in magnetron sputtering of silicon wafers on the sputter system in DTU Danschips cleanroom. We want to investigate and optimize the sputter deposition process and map how the parameters affects the thickness of different types of metals, dielectrics or semiconductors on silicon wafers. The thickness will be measured in-situ by an ellipsometer layer by layer by fitting different types of material models to the data, which in turn predict the growth rate for each layer. An ex-situ measurement of the total multilayer thickness will also be carried out as a comparison to the model fit.		\|The purpose of this project and following journal is to characterise the material thickness produced using parameters such as pressure, power and ratio of source materials used in magnetron sputtering of silicon wafers on the sputter system in DTU Danschips cleanroom. We want to investigate and optimize the sputter deposition process and map how the parameters affects the thickness of different types of metals, dielectrics or semiconductors on silicon wafers. The thickness will be measured in-situ by an ellipsometer layer by layer by fitting different types of material models to the data, which in turn predict the growth rate for each layer. An ex-situ measurement of the total multilayer thickness will also be carried out as a comparison to the model fit.
	\|[[~~index.php?title=~~Media:3 weeks course Zakaria Abachri (s134237) Rune Sixten Grass (s134243).pdf\|Optimization of thin film deposition using in-situ ellipsometry]]		\|[[Media:3 weeks course Zakaria Abachri (s134237) Rune Sixten Grass (s134243).pdf\|Optimization of thin film deposition using in-situ ellipsometry]]
	\|ellipsometry, thin film, in-situ, sputtering, lesker		\|ellipsometry, thin film, in-situ, sputtering, lesker
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	\|Jens Hemmingsen s135101		\|Jens Hemmingsen s135101
	\|Laser ablation is a method used to remove material from a solid surface, by irradiating it with a laser beam. The material directly underneath the beam is heated and then evaporates. The process can be compared to old fashioned machine milling, in which a rotary tool is used to remove material from a solid surface, and indeed laser ablation is also known as laser micromachining. There are a lot of different, sometimes interdependent, process parameters used in the milling process, which means that the ablation removal rate often depends on the specific design pattern used in a particular job. The goal of this project is to reduce the need for design-specific process optimization or to find ways to simplify the process optimization.		\|Laser ablation is a method used to remove material from a solid surface, by irradiating it with a laser beam. The material directly underneath the beam is heated and then evaporates. The process can be compared to old fashioned machine milling, in which a rotary tool is used to remove material from a solid surface, and indeed laser ablation is also known as laser micromachining. There are a lot of different, sometimes interdependent, process parameters used in the milling process, which means that the ablation removal rate often depends on the specific design pattern used in a particular job. The goal of this project is to reduce the need for design-specific process optimization or to find ways to simplify the process optimization.
	\|[[~~index.php?title=~~Media:3-weeks course - Jens Hemmingsen - micro-3W laser micromachining.pdf\|Laser micromachining of silicon microstructures]]		\|[[Media:3-weeks course - Jens Hemmingsen - micro-3W laser micromachining.pdf\|Laser micromachining of silicon microstructures]]
	\|laser micro machining, silicon, dicing		\|laser micro machining, silicon, dicing
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	\|}		\|}