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	<title>File:WF 2E02 mar23 2011-030.jpg - Revision history</title>
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	<updated>2026-05-08T09:46:09Z</updated>
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		<title>Jml: The profiles of the 211 nm thick zep resist wafers (The E-batch of march 23 2011). The wafers have been over-exposed in the E-beam (400 µC/cm2) to make sure that all structures are opened - therefore the 30, 60, 90, 120 and 150 nm lines are somewhat wide</title>
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		<updated>2011-04-07T13:17:42Z</updated>

		<summary type="html">&lt;p&gt;The profiles of the 211 nm thick zep resist wafers (The E-batch of march 23 2011). The wafers have been over-exposed in the E-beam (400 µC/cm2) to make sure that all structures are opened - therefore the 30, 60, 90, 120 and 150 nm lines are somewhat wide&lt;/p&gt;
&lt;p&gt;&lt;b&gt;New page&lt;/b&gt;&lt;/p&gt;&lt;div&gt;The profiles of the 211 nm thick zep resist wafers (The E-batch of march 23 2011). The wafers have been over-exposed in the E-beam (400 µC/cm2) to make sure that all structures are opened - therefore the 30, 60, 90, 120 and 150 nm lines are somewhat wider.&lt;/div&gt;</summary>
		<author><name>Jml</name></author>
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