LabAdviser - Recent changes [en]

Specific Process Knowledge/Characterization/XRD/XRD Powder/XRD Powder software

Reet — Tue, 28 Apr 2026 10:24:54 GMT

For adjusting measurement recipes

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	====For data export====		====For data export====
	The DataViewer software is a basic program from Malvern Panalytical that accompanies the XRD Powder and allows you to view your measurement results, do simple operations, and export to other formats, e.g., csv or txt. To install DataViewer, please see [https://labmanager.dtu.dk/view_binary.php?fileId=~~5535~~ this document in LabManager] ''- requires login.''		The DataViewer software is a basic program from Malvern Panalytical that accompanies the XRD Powder and allows you to view your measurement results, do simple operations, and export to other formats, e.g., csv or txt. To install DataViewer, please see [https://labmanager.dtu.dk/view_binary.php?fileId=6690 this document in LabManager] ''- requires login.''

	====For adjusting measurement recipes====		====For adjusting measurement recipes====
	To adjust the measurement recipes you need to use the XRDMP Creator mentioned above. This can be found on the support computer ~~right on~~ the ~~instrument apart from being~~ installed on your own computer (see link above for download instructions). Please ask responsible staff for instruction before you start using it on your own. Notice that if you need ~~''fluorescence suppression'' in your program,~~ for ~~now~~ you ~~need to use~~ the ~~version of XRDMP Creator on the support computer next to the XRD~~.		To adjust the measurement recipes you need to use the XRDMP Creator mentioned above. This can be found on the support computer across the hallway in room 904 and can also be installed on your own computer (see link above for download instructions, as it comes bundled with DataViewer). Please ask responsible staff for instruction before you start using it on your own.
			Notice that you need the newest version (from 2026) for transmission measurement setup. This is also what you will find in the link.

	====For data analysis====		====For data analysis====

LabAdviser/Courses

Reet — Thu, 23 Apr 2026 09:44:29 GMT

Equipment Tutorials

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	\|-		\|-
	\|- style="background:LightGrey; color:black" valign="center"		\|- style="background:LightGrey; color:black" valign="center"
			! E-beam Evaporators
			\| for getting access to the E-beam Evaporator [[Specific Process Knowledge/Thin film deposition/Temescal \| Temescal]] or [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator \| 10-pocket E-beam Evaporator]]
			\|This online course consists of four short training videos regarding equipment operation for both tools.
			* [https://learn.inside.dtu.dk/d2l/le/lessons/312055/lessons/1163908 E-beam Evaporator Training videos in DTU Learn]
			* [https://www.youtube.com/playlist?list=PLjWVU97LayHCQWuQyHwddJnpsEYfQp0wf same videos on Youtube]
			\|-
			\|- style="background:WhiteSmoke; color:black" valign="center"
	!E-beam Lithography		!E-beam Lithography
	\|for getting access to [[Specific Process Knowledge/Lithography/EBeamLithography \| E-beam Lithography Tools]]		\|for getting access to [[Specific Process Knowledge/Lithography/EBeamLithography \| E-beam Lithography Tools]]
	\|This online tutorial will be part of the E-beam TPT and is currently under prepration. <!-- ADDED WHEN TPT IS READY: It will include theory on electron beam lithography and equipment, as well as training in preparation of exposure files and equipment operation.!--> The course is a prerequisite for hands-on training on the electron beam tool. Find more information about the training in the [[LabAdviser/Courses/TPT Ebeam\|TPT E-beam]].		\|This online tutorial will be part of the E-beam TPT and is currently under prepration. <!-- ADDED WHEN TPT IS READY: It will include theory on electron beam lithography and equipment, as well as training in preparation of exposure files and equipment operation.!--> The course is a prerequisite for hands-on training on the electron beam tool. Find more information about the training in the [[LabAdviser/Courses/TPT Ebeam\|TPT E-beam]].
	\|-		\|-
	\|- style="background:~~WhiteSmoke~~; color:black" valign="center"		\|- style="background:LightGrey; color:black" valign="center"
	!Ellipsometer VASE		!Ellipsometer VASE
	\|for getting access to the [[Specific Process Knowledge/Characterization/Optical characterization#Ellipsometer VASE and Ellipsometer M-2000V\|Ellipsometers]]		\|for getting access to the [[Specific Process Knowledge/Characterization/Optical characterization#Ellipsometer VASE and Ellipsometer M-2000V\|Ellipsometers]]
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	* [https://www.youtube.com/watch?v=EC-oyRhKr0A\|Ellipsometer Ellipsometer operation ''by DTU Nanolab'']		* [https://www.youtube.com/watch?v=EC-oyRhKr0A\|Ellipsometer Ellipsometer operation ''by DTU Nanolab'']
	\|-		\|-
	\|- style="background:~~LightGrey~~; color:black" valign="center"		\|- style="background:WhiteSmoke; color:black" valign="center"
	! Atomic Force Microscopy		! Atomic Force Microscopy
	\| for getting access to the [[Specific Process Knowledge/Characterization/AFM:_Atomic_Force_Microscopy \| AFM equipment]]		\| for getting access to the [[Specific Process Knowledge/Characterization/AFM:_Atomic_Force_Microscopy \| AFM equipment]]
	\|This online course consists of three short training videos regarding equipment operation.		\|This online course consists of three short training videos regarding equipment operation.
	* [https://www.youtube.com/watch?v=i6JXopjBiy4&list=PLjWVU97LayHC9xeoG2uv8IaHuY7t-q0Tj AFM Icon-PT Operation]		* [https://www.youtube.com/watch?v=i6JXopjBiy4&list=PLjWVU97LayHC9xeoG2uv8IaHuY7t-q0Tj AFM Icon-PT Operation]
	\|-
	~~\|- style="background:WhiteSmoke; color:black" valign="center"~~
	~~! Temescal E-beam evaporator~~
	\| for getting access to the E-beam Evaporators [[Specific Process Knowledge/Thin film deposition/Temescal \| (Temescal)]] or [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator \| (10-Pockets)]]
	~~\|This online course consists of four short training videos regarding equipment operation:~~
	* [https://www.youtube.com/playlist?list=PLjWVU97LayHCQWuQyHwddJnpsEYfQp0wf Temescal Operation (Youtube videos)]
	* [https://learn.inside.dtu.dk/d2l/le/lessons/312055/lessons/1163908 Temescal Operation (DTU Learn module with the same videos plus a link to the manual in LabManager)]
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	* Equipment operation by DTU Nanolab:		* Equipment operation by DTU Nanolab:
	: [https://www.youtube.com/playlist?list=PLjWVU97LayHBtOkPCSv8QA-sD4Dbz1jrb XPS Operation]		: [https://www.youtube.com/playlist?list=PLjWVU97LayHBtOkPCSv8QA-sD4Dbz1jrb XPS Operation]
	\|-
	\|-
	~~\|- style="background:LightGrey; color:black" valign="center"~~
	~~! E-beam Evaporators~~
	\| for getting access to the [[Specific Process Knowledge/Thin film deposition/Temescal \| Temescal]] or [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator \| 10-pocket E-beam Evaporator]]
	~~\|This online course consists of four short training videos regarding equipment operation for both tools.~~
	* [https://learn.inside.dtu.dk/d2l/le/lessons/312055/lessons/1163908 E-beam Evaporator Training]
	\|-		\|-
	\|}		\|}

LabAdviser/LabManager/Booking Guide

Mmat — Tue, 21 Apr 2026 15:51:20 GMT

Finding the desired calendar

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	===Finding the desired calendar===		===Finding the desired calendar===

	# '''Select the type of calendar you wish to see.''' User refers to you - this is the collection of all your bookings. If there is an operator from ~~DCH/CEN~~, it is also visible in the operator's calender. Equipment is of course the calendar of the equipment, but for the daily and weekly view, slim calendars of the equipment status and your own bookings are also seen. To change equipment in the weekly or monthly view click the Equipment again, and click on the stepstones (see below).		# '''Select the type of calendar you wish to see.''' User refers to you - this is the collection of all your bookings. If there is an operator from DTU Nanolab, it is also visible in the operator's calender. Equipment is of course the calendar of the equipment, but for the daily and weekly view, slim calendars of the equipment status and your own bookings are also seen. To change equipment in the weekly or monthly view click the Equipment again, and click on the stepstones (see below).
	# '''Select a daily, weekly or a monthly view.''' The daily view will be the same whether you have chosen User or Equipment, because there is room for both your bookings and the calendars of different equipment side by side. The daily calendar is the default choice, when you click on Booking in the menu and will display calendars of equipment you have booked for today.		# '''Select a daily, weekly or a monthly view.''' The daily view will be the same whether you have chosen User or Equipment, because there is room for both your bookings and the calendars of different equipment side by side. The daily calendar is the default choice, when you click on Booking in the menu and will display calendars of equipment you have booked for today.
	# '''If you need to see another date of the calendar, click the text field to open the small calendar.''' Browse to find the desired day. On the weekly and monthly calendars you can also click on the arrows to move one week/month ahead or back.		# '''If you need to see another date of the calendar, click the text field to open the small calendar.''' Browse to find the desired day. On the weekly and monthly calendars you can also click on the arrows to move one week/month ahead or back.

LabAdviser/Courses

Reet — Tue, 21 Apr 2026 12:43:44 GMT

Equipment Tutorials

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	! Temescal E-beam evaporator		! Temescal E-beam evaporator
	\| for getting access to the E-beam Evaporators [[Specific Process Knowledge/Thin film deposition/Temescal \| (Temescal)]] or [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator \| (10-Pockets)]]		\| for getting access to the E-beam Evaporators [[Specific Process Knowledge/Thin film deposition/Temescal \| (Temescal)]] or [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator \| (10-Pockets)]]
	\|This online course consists of four short training videos regarding equipment operation.		\|This online course consists of four short training videos regarding equipment operation:
	* [https://www.youtube.com/playlist?list=PLjWVU97LayHCQWuQyHwddJnpsEYfQp0wf Temescal Operation]		* [https://www.youtube.com/playlist?list=PLjWVU97LayHCQWuQyHwddJnpsEYfQp0wf Temescal Operation (Youtube videos)]
			* [https://learn.inside.dtu.dk/d2l/le/lessons/312055/lessons/1163908 Temescal Operation (DTU Learn module with the same videos plus a link to the manual in LabManager)]
	\|-		\|-
	\|- style="background:LightGrey; color:black" valign="center"		\|- style="background:LightGrey; color:black" valign="center"

LabAdviser/314/Microscopy 314-307/Postprocessing

Jenk — Tue, 21 Apr 2026 11:39:01 GMT

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	<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png\|200px]]		<!-- <span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png\|200px]] -->

	{{cc-nanolab}}		{{cc-nanolab}}
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	After you are added to the access list, follow the guide:		After you are added to the access list, follow the guide:

			[[File:Citrix login.png\|400px\|thumb\|left\|Go to https://remote.dtu.dk and login with your DTU credentials]] <br clear="all" />

	= ~~Available software for post-processing =~~		[[File:Citrix Apps.png\|400px\|thumb\|left\|Go to "Apps" and find the remote computers (marked with red circle in the image)]] <br clear="all" />

			[[File:Citrix_computer-login.png\|200px\|thumb\|left\|Login with your DTU credentials]] <br clear="all" />

	~~At DTU Nanolab~~ - ~~building 314/307 you will find a small PC lab where there is access~~ to all the ~~processing and productivity software available~~ at ~~DTU Nanolab. The lab is located in building 307 room 101. There are four workstations which you can access with your DTU credentials~~. ~~The following software is installed on~~ all ~~workstations:~~		[[File:Citrix sign-out.png\|400px\|thumb\|left\|Remember to Sign out when done with the work. Don't save data on these PCs; all saved data during the session should be removed at the end of the session.]] <br clear="all" />

	~~Microsoft Office~~

	~~Digital Micrograph~~ - ~~GMS v2 and v3 (TEM image~~ processing ~~and analysis)~~		= Available software for post-processing =

	~~TIA v4.19 (TEM/STEM image processing and analysis)~~

	~~JEMS v4.3905 (TEM/STEM/Diffraction analysis and simulation)~~

	~~AZtec v3.3 (SEM and TEM) (EDX spectrum and map analysis)~~

	~~INCA v5.0.5 (EDX analysis)~~

	~~Avizo v9.5 (3D rendering)~~		The following software is installed on the different workstations:

	~~<!-- Crystalmaker v9.2.7 (Crystal structure building)~~

	~~Crystaldiffract v6.5.5~~ (~~Diffraction~~ analysis)		Gatan GMS v3 (TEM/STEM image processing and analysis)

	~~Single crystal v2.3.3~~ (~~Diffraction from single crystals~~) ~~-->~~		ThermoFisher Velos (TEM/STEM image and EDS processing and analysis)

			ThermoFisher TIA v4.19 (TEM/STEM image processing and analysis)

	~~Additionally, some of the workstations have node-locked licenses to:~~		Oxford AZtec v6 (EDS and EBSD analysis)

	~~PANalytical X’pert Highscore Plus~~ (~~XRD data~~ analysis)~~: Cen-Himmelbjerg, Cen-Froebjerg, Cen-Valbybakke~~		EDAX OIM v9 (EBSD analysis)

	~~Inspect 3D~~ (~~Tomography reconstruction~~)~~: Cen-Himmelbjerg, Cen-Froebjerg~~		Bruker Esprit v2 (EDS and EBSD analysis)

	~~TrueImage v2.0.1~~ (~~TEM image reconstruction~~)~~: Cen-Himmelbjerg, Cen-Froebjerg, Cen-Valbybakke, Cen-Yding~~		ThermoFisher Avizo (3D rendering)

	~~Esprit 2.0~~ (~~EBSD, TKD and EDS, flatquad and particle analyses~~)~~: Cen-Himmelbjerg, Cen-Froebjerg, Cen-Valbybakke, Cen-Yding~~		Crystalmaker v11 (Crystal structure building)

			Crystaldiffract v7 (Diffraction analysis)

			Inspect 3D (Tomography reconstruction)


	~~Additionally, there is one workstation available in the lobby of 314. The same software is installed on this machine.~~

			Additionally, there is one workstation available in the lobby of 314. This has mainly Oxford Aztec available.

	Please remember to log out when you have finished your work. Do not turn off the workstations.		Please remember to log out when you have finished your work. Do not turn off the workstations.

File:Citrix sign-out.png

Jenk — Tue, 21 Apr 2026 11:36:11 GMT

Jenk uploaded File:Citrix sign-out.png

New page

Sign out

File:Citrix computer-login.png

Jenk — Tue, 21 Apr 2026 11:33:47 GMT

Jenk uploaded File:Citrix computer-login.png

New page

computer login

File:Citrix Apps.png

Jenk — Tue, 21 Apr 2026 11:32:38 GMT

Jenk uploaded File:Citrix Apps.png

New page

Find remote computers under Apps

File:Citrix login.png

Jenk — Tue, 21 Apr 2026 11:28:14 GMT

Jenk uploaded File:Citrix login.png

New page

remote.dtu.dk login

LabAdviser/314/Microscopy 314-307/Postprocessing

Jenk — Tue, 21 Apr 2026 10:19:03 GMT

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	<br>		<br>
	<br>		<br>
			= Access to software =

			We have a couple of workstations available with relevant software installed. These can be accessed via [https://remote.dtu.dk remote.dtu.dk] (DTUs Citrix remote system).

			Before being able to access, you need to write a mail to jenk@dtu.dk.

			After you are added to the access list, follow the guide:


	= Available software for post-processing =		= Available software for post-processing =

LabAdviser/Courses

Mmat — Mon, 20 Apr 2026 14:00:18 GMT

Equipment Tutorials

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	* Equipment operation by DTU Nanolab:		* Equipment operation by DTU Nanolab:
	: [https://www.youtube.com/playlist?list=PLjWVU97LayHBtOkPCSv8QA-sD4Dbz1jrb XPS Operation]		: [https://www.youtube.com/playlist?list=PLjWVU97LayHBtOkPCSv8QA-sD4Dbz1jrb XPS Operation]
			\|-
			\|-
			\|- style="background:LightGrey; color:black" valign="center"
			! E-beam Evaporators
			\| for getting access to the [[Specific Process Knowledge/Thin film deposition/Temescal \| Temescal]] or [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator \| 10-pocket E-beam Evaporator]]
			\|This online course consists of four short training videos regarding equipment operation for both tools.
			* [https://learn.inside.dtu.dk/d2l/le/lessons/312055/lessons/1163908 E-beam Evaporator Training]
	\|-		\|-
	\|}		\|}

Specific Process Knowledge/Lithography/Resist/UVresist/exposureDoseNaOH

Jehem — Mon, 20 Apr 2026 11:27:36 GMT

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			{{cc-nanolab}}

	=Exposure dose when using AZ 351B as developer=		=Exposure dose when using AZ 351B as developer=
	The exposure doses listed below are for ''generic'' good exposure results, and can be a compromise between getting good lines, as well as good dots, in both clear field and dark field exposures. The optimal dose for any given specific project, could be different from the listed values.		The exposure doses listed below are for ''generic'' good exposure results, and can be a compromise between getting good lines, as well as good dots, in both clear field and dark field exposures. The optimal dose for any given specific project, could be different from the listed values.

Specific Process Knowledge/Lithography/Resist/UVresist/exposureDoseMasklessAligners

Jehem — Mon, 20 Apr 2026 11:27:24 GMT

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			{{cc-nanolab}}

	=Exposure dose for maskless aligners=		=Exposure dose for maskless aligners=
	The exposure doses listed below are for ''generic'' good exposure results, and can be a compromise between getting good lines, as well as good dots, in both clear field and dark field exposures. The optimal dose and achievable resolution for any given specific project, could be different from the listed values.		The exposure doses listed below are for ''generic'' good exposure results, and can be a compromise between getting good lines, as well as good dots, in both clear field and dark field exposures. The optimal dose and achievable resolution for any given specific project, could be different from the listed values.

Specific Process Knowledge/Lithography/Resist/UVresist/exposureDoseMaskAligners

Jehem — Mon, 20 Apr 2026 11:27:10 GMT

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			{{cc-nanolab}}

	=Exposure dose for mask aligners=		=Exposure dose for mask aligners=
	The exposure doses listed below are for ''generic'' good exposure results, and can be a compromise between getting good lines, as well as good dots, in both clear field and dark field exposures. The optimal dose for any given specific project, could be different from the listed values.		The exposure doses listed below are for ''generic'' good exposure results, and can be a compromise between getting good lines, as well as good dots, in both clear field and dark field exposures. The optimal dose for any given specific project, could be different from the listed values.

Specific Process Knowledge/Lithography/TIspray

Jehem — Mon, 20 Apr 2026 11:26:40 GMT

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	{{~~:Specific Process Knowledge/Lithography/authors_generic~~}}		{{cc-nanolab}}

	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/5214E click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/5214E click here]'''

Specific Process Knowledge/Lithography/SU-8

Jehem — Mon, 20 Apr 2026 11:26:28 GMT

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	{{~~:Specific Process Knowledge/Lithography/authors_generic~~}}		{{cc-nanolab}}

	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/SU-8 click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/SU-8 click here]'''

Specific Process Knowledge/Lithography/4562

Jehem — Mon, 20 Apr 2026 11:26:17 GMT

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	{{~~:Specific Process Knowledge/Lithography/authors_generic~~}}		{{cc-nanolab}}

	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/4562 click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/4562 click here]'''

Specific Process Knowledge/Lithography/nLOF

Jehem — Mon, 20 Apr 2026 11:26:07 GMT

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	{{~~:Specific Process Knowledge/Lithography/authors_generic~~}}		{{cc-nanolab}}

	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/nLOF click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/nLOF click here]'''

Specific Process Knowledge/Lithography/MiR

Jehem — Mon, 20 Apr 2026 11:25:57 GMT

← Older revision		Revision as of 13:25, 20 April 2026
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	{{~~:Specific Process Knowledge/Lithography/authors_generic~~}}		{{cc-nanolab}}

	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/MiR click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/MiR click here]'''

Specific Process Knowledge/Lithography/5214E

Jehem — Mon, 20 Apr 2026 11:25:47 GMT

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	{{~~:Specific Process Knowledge/Lithography/authors_generic~~}}		{{cc-nanolab}}

	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/5214E click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/5214E click here]'''

Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 04 processing

Jehem — Mon, 20 Apr 2026 11:24:23 GMT

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	<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png\|200px]]		<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png\|200px]]
	-->		-->
	{{~~:Specific Process Knowledge/Lithography/authors_generic~~}}		{{cc-nanolab}}

	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_04_processing click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_04_processing click here]'''

Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 03 processing

Jehem — Mon, 20 Apr 2026 11:24:07 GMT

← Older revision		Revision as of 13:24, 20 April 2026
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	{{~~:Specific Process Knowledge/Lithography/authors_generic~~}}		{{cc-nanolab}}

	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing click here]'''

Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 02 processing

Jehem — Mon, 20 Apr 2026 11:23:50 GMT

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	{{~~:Specific Process Knowledge/Lithography/authors_generic~~}}		{{cc-nanolab}}

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Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing

Taran — Mon, 20 Apr 2026 11:23:38 GMT

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Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 01 processing

Jehem — Mon, 20 Apr 2026 11:23:29 GMT

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Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma UV processing

Taran — Mon, 20 Apr 2026 11:23:09 GMT

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	{{~~:Specific Process Knowledge/Lithography/authors_generic~~}}		{{cc-nanolab}}

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Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing

Jehem — Mon, 20 Apr 2026 11:22:18 GMT

← Older revision		Revision as of 13:22, 20 April 2026
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	{{~~:Specific Process Knowledge/Lithography/authors_generic~~}}		{{cc-nanolab}}

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Specific Process Knowledge/Characterization/XRD/XRD SmartLab

Reet — Wed, 15 Apr 2026 15:00:44 GMT

XRD SmartLab

← Older revision		Revision as of 17:00, 15 April 2026
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	[http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Characterization/XRD/Process_Info Process information]		[http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Characterization/XRD/Process_Info Process information]

			The basic optical components and the automatic optical alignment steps are described here:

			[https://www.youtube.com/watch?v=AbM1TwG5HyU Optical alignment video on Rigaku's Youtube channel]

	The measurement settings and results of the pre-acceptance test are described in this document, also found on the Lab Manager:		The measurement settings and results of the pre-acceptance test are described in this document, also found on the Lab Manager:

Specific Process Knowledge/Lithography/mrEBL6000

Mmat — Tue, 14 Apr 2026 10:28:51 GMT

Mmat deleted page Specific Process Knowledge/Lithography/mrEBL6000 content before blanking was: " <br> mrEBL6000 works as a negative e-beam resist but is also UV sensitive, why resist and coated wafers should be kept in yellow rooms only. When carrying the wafers to the e-beam writer, use a black or blue box for protection. While mounting the wafers in the e-beam cassettes, you can turn off the white light in the e-beam room and turn on the yellow light which is located above the pre-aligner setup. Please mount as close to exposure as possible and turn of..."

Specific Process Knowledge/Lithography/EBeamLithographyManual

Mmat — Tue, 14 Apr 2026 10:28:31 GMT

Mmat deleted page Specific Process Knowledge/Lithography/EBeamLithographyManual content before blanking was: "= Purpose, location and technical specifications = The JEOL JBX-9500FS electron beam lithography system is a spot electron beam lithography system designed for use in writing patterns with dimensions from nanometers to sub-micrometers. Substrates that needs e-beam exposure should be mounted in a cassette and transferred into the writer via the robot loader (autoloader). To request for an e-beam training session, contact e-beam@nanolab.dtu.dk; a DTU Nanolab..."

Specific Process Knowledge/Thermal Process/Furnace: Multipurpose annealing

Pevo — Fri, 10 Apr 2026 09:49:32 GMT

The Resist Pyrolysis furnace (from February 2024)

← Older revision		Revision as of 11:49, 10 April 2026
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	[[Image:ATV_ovn_boat.jpg\|thumb\|335x335px\|Boat with wafers for the Resist Pyrolysis furnace. Photo: DTU Nanolab internal]]		[[Image:ATV_ovn_boat.jpg\|thumb\|335x335px\|Boat with wafers for the Resist Pyrolysis furnace. Photo: DTU Nanolab internal]]

	The Resist Pyrolysis furnace it made by ATV Technologie, and it was installed in the cleanroom in ~~November 2014~~.		The Resist Pyrolysis furnace it made by ATV Technologie, and it was installed in the cleanroom in January 2015.

	In November 2024 the furnace was repaired by ATV Technologie. At the repair, the whole furnace body was changed, and all heaters were replaced. Also, the process exhaust flow was decreased by changing a valve in the exhaust line.		In November 2024 the furnace was repaired by ATV Technologie. At the repair, the whole furnace body was changed, and all heaters were replaced. Also, the process exhaust flow was decreased by changing a valve in the exhaust line.
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	The Resist Pyrolysis furnace is a research tool. It means, that it is mainly available for users working on certain research projects, especially in the Biomaterial Microsystems Group at DTU Nanolab.		The Resist Pyrolysis furnace is a research tool. It means, that it is mainly available for users working on certain research projects, especially in the Biomaterial Microsystems Group at DTU Nanolab.

	The furnace is mainly being used for resist pyrolysis. It can also be used for annealing in nitrogen (N<sub>2</sub>) and oxidation with oxygen (O<sub>2</sub>), but O<sub>2</sub> is mostly used for cleaning of the furnace after resist pyrolysis processes.		The furnace is mainly being used for resist pyrolysis. It can also be used for annealing in nitrogen (N<sub>2</sub>) (or forming gas, i.e. up to 4% H<sub>2</sub> mixed with N<sub>2</sub>, but this has not been tested) and oxidation with oxygen (O<sub>2</sub>), but O<sub>2</sub> is mostly used for cleaning of the furnace after resist pyrolysis processes.

	Process steps can run either at atmospheric pressure or in vacuum. A small N<sub>2</sub> or O<sub>2</sub> flow (up to 2 ~~slm~~) can be applied in vacuum steps.		For resist pyrolysis, samples with different resist layers are heated up to maximum 1050 <sup>o</sup>C in a nitrogen atmosphere. At high temperatures carbon is formed by pyrolysis of the resist. In this way conductive structures can be made from a resist patterned sample. If oxygen from the air or from outgassing of the resist is present in the furnace, the resist layer will be removed, thus it is important to evacuate the furnace and flush it with nitrogen, before a high temperature for resist pyrolysis is obtained. Pyrolysis of a large amount of resist may also be a problem due to resist outgassing.

			Process steps can run either at atmospheric pressure or in vacuum. A small N<sub>2</sub> or O<sub>2</sub> flow (up to 2 SLM) can be applied in vacuum steps.

	The quartz parts in the furnace (the furnace tube, the door sealing and the wafer boat) can be changed, depending on what processes and samples the furnace is used for, but it has been decided that a quartz set for resist resist pyrolysis will be mounted in the furnace all the time. This limits the number of materials that are allowed in the furnace.		The quartz parts in the furnace (the furnace tube, the door sealing and the wafer boat) can be changed, depending on what processes and samples the furnace is used for, but it has been decided that a quartz set for resist resist pyrolysis will be mounted in the furnace all the time. This limits the number of materials that are allowed in the furnace.

	Please note that all new resist and other materials have to be approved by the Thin Film group (thinfilm@nanolab.dtu.dk) before they are allowed in the furnace.		Please note that all new resist types and other materials have to be approved by the Thin Film group (thinfilm@nanolab.dtu.dk) before they are allowed in the furnace.

	All process gases (except purge nitrogen) are heated, before they are introduced into the furnace at the door side.		All process gases (except purge nitrogen) are heated, before they are introduced into the furnace at the door side.

	The furnace tube is heated by use of 12 long heaters situated along the furnace tube and combined in three groups (top, bottom left and bottom right) and two flat heaters situated in the ends of the furnace tube. ~~The this way~~ the temperature will be very uniform everywhere in the furnace tube. The heating can be done very fast, up to 30 <sup>o</sup>C/min. The maximum allowed process temperature is normally 1050 <sup>o</sup>C, however up to 1100 <sup>o</sup>C without vacuum is possible. The maximum allowed process time at 1050 <sup>o</sup>C is 3 hours.		The furnace tube is heated by use of 12 long heaters situated along the furnace tube and combined in three groups (top, bottom left and bottom right) and two flat heaters situated in the ends of the furnace tube. This ensures that the temperature will be very uniform everywhere in the furnace tube. The heating can be done very fast, up to 30 <sup>o</sup>C/min. The maximum allowed process temperature is normally 1050 <sup>o</sup>C, however up to 1100 <sup>o</sup>C without vacuum is possible. The maximum allowed process time at 1050 <sup>o</sup>C is 3 hours.

	The furnace body surrounding the furnace tube consists of a top and bottom half-shell. To cool down the furnace (when the temperature is below 800 <sup>o</sup>C), the top half shelf can be lifted up, and cooling fans will then flow air from the surroundings around the furnace tube to cool it down. However, for safety reasons, the cooling fans will not the activated when there is hydrogen in the furnace, and cooling will then be very slow.

	~~It is not possible to open~~ the furnace when the temperature is ~~above 300~~ <sup>o</sup>C.		The furnace body surrounding the furnace tube consists of a top and bottom half-shell. To cool down the furnace (when the temperature is below 800 <sup>o</sup>C and not for processes with H<sub>2</sub>), the top half shelf can be lifted up, and cooling fans will then flow air from the surroundings around the furnace tube to cool it down.

	~~For resist pyrolysis~~, ~~samples with different resist layers are heated up to maximum 1050~~ <sup>o</sup>C in a nitrogen atmosphere. At high temperatures carbon is formed by pyrolysis of the resist. In this way conductive structures can be made from a resist patterned sample. If oxygen from the air or from outgassing of the resist is present in the furnace, the resist layer will be removed, thus it is important to evacuate the furnace and flush it with nitrogen, before a high temperature for resist pyrolysis is obtained. Pyrolysis of a large amount of resist may also be a problem due to resist outgassing.		It is not possible to open the furnace, when the temperature is above 300 <sup>o</sup>C.


	'''The user manual, technical information and contact information can be found in LabManager:'''		'''The user manual, technical information and contact information can be found in LabManager:'''

	'''[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=340 ~~Furnace: Multipurpose annealing~~]'''		'''[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=340 Resist Pyrolysis furnace]'''

	==Process information==		==Process information==
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	*Annealing: look at the [[Specific Process Knowledge/Thermal Process/Annealing\|Annealing]] page		*Annealing: look at the [[Specific Process Knowledge/Thermal Process/Annealing\|Annealing]] page
	*[[Specific_Process_Knowledge/Thermal_Process/Furnace:_Multipurpose_annealing/Acceptance test\|Results from the Resist Pyrolysis furnace acceptance test]]		*[[Specific_Process_Knowledge/Thermal_Process/Furnace:_Multipurpose_annealing/Acceptance test\|Results from the Resist Pyrolysis furnace acceptance test]]
	*[[Specific_Process_Knowledge/Thermal_Process/Pyrolysis/Pyrolysis_with_Multipurpose_Anneal_Furnace\|~~Pyrolysis~~]]		*[[Specific_Process_Knowledge/Thermal_Process/Pyrolysis/Pyrolysis_with_Multipurpose_Anneal_Furnace\|Resist pyrolysis]]

	==Overview of the performance of the ATV furnace and process related parameters==		==Overview of the performance of the ATV furnace and process related parameters==
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	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Pyrolysis of different resists		*Pyrolysis of different resists
			*Annealing in N<sub>2</sub>
			*Annealing in forming gas (up to 5% H<sub>2</sub> mixed with N<sub>2</sub>) - Not tested
	*Dry oxidation of silicon		*Dry oxidation of silicon
	*Annealing in N<sub>2</sub>,
	*Annealing in forming gas (up to 5% H<sub>2</sub> mixed with N<sub>2</sub>) - Needs to be tested
	\|-		\|-
	!style="background:silver; color:black" align="center"\|Performance		!style="background:silver; color:black" align="center"\|Performance
	\|style="background:LightGrey; color:black"\|Film thickness		\|style="background:LightGrey; color:black"\|Film thickness
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Dry oxidation: 50 Å to ~200 nm SiO<sub>2</sub> (it takes too long to grow a thicker oxide layer)		*Dry oxidation of silicon: 50 Å to ~200 nm SiO<sub>2</sub> (it takes too long to grow a thicker oxide layer)
	\|-		\|-
	!style="background:silver; color:black" align="center" valign="center" rowspan="4"\|Process parameter range		!style="background:silver; color:black" align="center" valign="center" rowspan="4"\|Process parameter range
	\|style="background:LightGrey; color:black"\|Process ~~Temperature~~		\|style="background:LightGrey; color:black"\|Process temperature
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*No vacuum: Room temperature - 1100 <sup>o</sup>C - Normally maximum 1050 <sup>o</sup>C allowed		*No vacuum: Room temperature - 1100 <sup>o</sup>C - Normally maximum 1050 <sup>o</sup>C allowed
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	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Atmospheric pressure		*Atmospheric pressure
	*Vacuum down to ~0.1 mbar (gas flow dependent)		*Vacuum: Pressure down to ~0.1 mbar (gas flow dependent)
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Gases on the system		\|style="background:LightGrey; color:black"\|Gases on the system
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	Atmospheric pressure:		Atmospheric pressure:
	*N<sub>2</sub>: 20 ~~slm~~ - Maximum 10 SLM recommended (to protect the heaters)		*N<sub>2</sub>: 20 SLM - Maximum 10 SLM recommended (to protect the heaters)
	*O<sub>2</sub>: 10 ~~slm~~		*O<sub>2</sub>: 10 SLM
	*H<sub>2</sub>: 5 ~~slm~~ - Not allowed		*H<sub>2</sub>: 5 SLM - Not allowed
	*N<sub>2</sub> mix : 10 ~~slm~~ (for forming gas H<sub>2</sub>-N<sub>2</sub> ~~gas mixture~~) - Not tested ~~and not allowed for vacuum processes~~		*N<sub>2</sub> mix: 10 SLM (for forming gas, i.e. up to 5% H<sub>2</sub> mixed with N<sub>2</sub>) - Not tested
	Vacuum:		Vacuum:
	*N<sub>2</sub>: 2 ~~slm~~		*N<sub>2</sub>: 2 SLM
	*O<sub>2</sub>: 2 ~~slm~~		*O<sub>2</sub>: 2 SLM
	*H<sub>2</sub>: Not allowed		*H<sub>2</sub>: Not allowed
	*N<sub>2</sub> mix : Not allowed		*N<sub>2</sub> mix : Not allowed
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	\|style="background:LightGrey; color:black"\|Substrate materials allowed		\|style="background:LightGrey; color:black"\|Substrate materials allowed
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*~~Depends on the quartz set~~		*Normally only samples for resist pyrolysis approved by Nanolab
	\|-		\|-
	\|}		\|}

Specific Process Knowledge/Thermal Process/Resist Pyrolysis furnace/Acceptance test

Pevo — Fri, 10 Apr 2026 08:56:30 GMT

← Older revision		Revision as of 10:56, 10 April 2026
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	==Multipurpose Anneal furnace acceptance test==		==Multipurpose Anneal furnace acceptance test==

	The acceptance for the Multipurpose Anneal furnace was performed in ~~November 2014~~ by ATV Technologie and DTU Nanolab.		The acceptance for the Multipurpose Anneal furnace was performed in January 2015 by ATV Technologie and DTU Nanolab.

	At the acceptance test a dry oxide layer was grown on a boat of 150 mm wafers. The oxide growth was repeated three times.		At the acceptance test a dry oxide layer was grown on a boat of 150 mm wafers. The oxide growth was repeated three times.

Specific Process Knowledge/Thermal Process/Furnace: Multipurpose annealing

Pevo — Fri, 10 Apr 2026 08:55:17 GMT

From February 2024: RESIST PYROLYSIS FURNACE

Show changes

Specific Process Knowledge/Characterization/XRD/Process Info/The Principles of X-ray Reflectivity Analysis

Reet — Fri, 10 Apr 2026 08:28:53 GMT

← Older revision		Revision as of 10:28, 10 April 2026
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	An X-ray reflectivity measurement is a θ-2θ measurement at very low angles from just below the angle of total external reflection to a few degrees above. In that range, films with a smooth surface display oscillations related to the thickness of the reflecting films. The angle of total external reflection is determined by the density of the top layer and the decay of the signal is related to the surface smoothness (the smoother the surface the slower the decay). Therefore XRR can be used to tell you the thickness, density and roughness of thin layers. To determine the parameters you must make a model to fit to the data, so the more layers, the more degrees of freedom, and the less you can trust the fit.		An X-ray reflectivity measurement is a θ-2θ measurement at very low angles from just below the angle of total external reflection to a few degrees above. In that range, films with a smooth surface display oscillations related to the thickness of the reflecting films. The angle of total external reflection is determined by the density of the top layer and the decay of the signal is related to the surface smoothness (the smoother the surface the slower the decay). Therefore XRR can be used to tell you the thickness, density and roughness of thin layers. To determine the parameters you must make a model to fit to the data, so the more layers, the more degrees of freedom, and the less you can trust the fit.

	Rigaku gives a very nice intuitive explanation of the principles behind the XRR in ~~this~~ [https://labmanager.dtu.dk/view_binary.php?fileId=4937\|paper] - requires login. Highly recommended if you do not know the technique.		The total layer thickness you can measure is up to around 300 nm depending on the density and roughness.

			Rigaku gives a very nice intuitive explanation of the principles behind the XRR in [https://labmanager.dtu.dk/view_binary.php?fileId=4937 this paper] - requires login. Highly recommended if you do not know the technique.

	The sections below give a very brief overview and some helpful hints and things to keep in mind.		The sections below give a very brief overview and some helpful hints and things to keep in mind.
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	image:eves_XRD_drawing_series_XRR2_20230206.png\|<b>For films between approximately 100 nm and 300 nm or for several layers with closely spaced oscillations: </b> Use the Ge monochromator on the incident side. Notice that RS2 is virtual and corresponds to the number of pixels or channels in use on the 1D or 2D detector.		image:eves_XRD_drawing_series_XRR2_20230206.png\|<b>For films between approximately 100 nm and 300 nm or for several layers with closely spaced oscillations: </b> Use the Ge monochromator on the incident side. Notice that RS2 is virtual and corresponds to the number of pixels or channels in use on the 1D or 2D detector.
	</gallery>		</gallery>

			As shown below, the oscillations are closer together for thicker layers, so you will need better resolution to measure such films. That's why the figures above show that you will in some cases need the monochromator for XRR and in other cases not.

	It's a good idea to use a very small incident slit as suggested by default by the Rigaku software (0.05 mm) and also use very small receiving slits to reduce background noise, e.g., RS1 = IS and RS2 sligthly larger.		It's a good idea to use a very small incident slit as suggested by default by the Rigaku software (0.05 mm) and also use very small receiving slits to reduce background noise, e.g., RS1 = IS and RS2 sligthly larger.

Specific Process Knowledge/Characterization/XRD/Process Info

Reet — Thu, 09 Apr 2026 14:01:29 GMT

XRR

@@ Line 89: / Line 89: @@
 ==XRR==
-<gallery caption="XPS recordings. 10 nm SiC deposited on Si wafer" widths="700px" heights="150px" perrow="2">
+XRR is a special case of a Theta/2Theta measurement. You can see the optics used for the measurements and read more about the principles here: [[/The Principles of X-ray Reflectivity Analysis|The principles of X-ray reflectivity analysis (XRR)]]
 ==In-Plane Measurements 2θχ or 2θχ/φ scans ==

Specific Process Knowledge/Characterization/XRD/Process Info/The Principles of X-ray Reflectivity Analysis

Reet — Thu, 09 Apr 2026 14:00:56 GMT

← Older revision		Revision as of 16:00, 9 April 2026
(One intermediate revision by the same user not shown)
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	Rigaku gives a very nice intuitive explanation of the principles behind the XRR in this [https://labmanager.dtu.dk/view_binary.php?fileId=4937\|paper] - requires login. Highly recommended if you do not know the technique.		Rigaku gives a very nice intuitive explanation of the principles behind the XRR in this [https://labmanager.dtu.dk/view_binary.php?fileId=4937\|paper] - requires login. Highly recommended if you do not know the technique.

			The sections below give a very brief overview and some helpful hints and things to keep in mind.

	=Experimental setup=		=Experimental setup=
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	=Thickness, roughness and density influence=		=Thickness, roughness and density influence=

	<gallery caption="XRR ~~analysis concept.~~" widths="450px" heights="650px" perrow="3">		<gallery caption="Simulated XRR data" widths="450px" heights="650px" perrow="3">
	image:eves_XRD_XRR_principles_thickness.png\| Simulated effect of different single layer thickness.		image:eves_XRD_XRR_principles_thickness.png\| Simulated effect of different single layer thickness.
	image:eves_XRD_XRR_principles_roughness.png\| Simulated effect of different roughness.		image:eves_XRD_XRR_principles_roughness.png\| Simulated effect of different roughness.
	image:eves_XRD_XRR_principles_density.png\| Simulated effect of different density.		image:eves_XRD_XRR_principles_density.png\| Simulated effect of different density.
	</gallery>		</gallery>