Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing: Difference between revisions

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 =Spin coating=
 Spin coating on Spin Coater: RCD8 consists of a selection of the following steps:
-#Optional: Acceleration to a low spin speed if dynamic dispense is used
 #Resist dispense
+#(Recipe start)
 #Optional: Closing the Gyrset (if used)
 #Optional: Resist spreading at low spin speed
 #Spin-off
 #Deceleration
-#Opening Gyrset
+#Opening Gyrset (if used)
-The wafer is first centered on the chuck and held in place by vacuum (or pins in the case of the non-vacuum chuck). If static dispense is used, the spindle remains static during the ensuing resist dispense. In the case of dynamic dispense, the spindle is accelerated to a low spin speed before the resist is dispensed. Using too high spin speed during dispense can cause surface wetting issues, while a too low spin speed causes the resist to flow onto the backside of the wafer. The resist may be dispensed manually, or automatically using the syringe dispense system on the media arm. After dispense, a short spin at low spin speed may be used in order to spread the resist over the wafer surface before spin-off.
+The wafer is first centered on the chuck and held in place by vacuum (or pins in the case of the non-vacuum chuck). After the resist has been dispensed, the recipe is started. A short spin at low spin speed may be used as the first step of the recipe, in order to spread the resist over the wafer surface before spin-off.
 The spin-off cycle determines the thickness of the resist coating. The thickness is primarily a function of the spin-off speed and the spin-off time, both following an inverse power-law.