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| Click [[Specific Process Knowledge/Characterization/XPS/Access | '''HERE''' ]] to see information on how to get access to the XPS. | | Click [[Specific Process Knowledge/Characterization/XPS/Access | '''HERE''' ]] to see information on how to get access to the XPS. |
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| == Performance of XPS Nexsa ==
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| {| border="2" cellspacing="0" cellpadding="1" |-
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| !style="background:silver; color:black;" align="left"|Purpose
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| |style="background:LightGrey; color:black"|Chemical analysis
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| |style="background:WhiteSmoke; color:black"|
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| * [[Specific Process Knowledge/Characterization/XPS/XPS elemental composition|Probing elemental composition]]
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| * [[Specific Process Knowledge/Characterization/XPS/XPS Chemical states |Chemical state identification]]
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| * Non destructive technique
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| * Surface sensitive
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| * [[Specific Process Knowledge/Characterization/XPS/XPS Depth profiling|Depth profiling]] possible by ion beam etch of sample
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| !rowspan="5" style="background:silver; color:black" align="left"| Performance
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| |style="background:LightGrey; color:black"|Spot size
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| |style="background:WhiteSmoke; color:black"|Can be set between 30µm - 400µm
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| |style="background:LightGrey; color:black"|Probing depth
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| |style="background:WhiteSmoke; color:black"|Depending on probed element. Max probe depth lies within 10-200 Å.
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| |style="background:LightGrey; color:black"|Resolution
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| |style="background:WhiteSmoke; color:black"|Dependent on probed elements. Concentrations down to about 0,5 atomic % can in some cases be detected.
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| |style="background:LightGrey; color:black"|Charge compensation
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| |style="background:WhiteSmoke; color:black"|
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| Flood gun can be used for charge compensation of non conductive samples
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| |style="background:LightGrey; color:black"|Finding structures
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| |style="background:WhiteSmoke; color:black"|Choose measuring spot from camera image (magnified)
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| !rowspan="2" style="background:silver; color:black" align="left"|Depth profiling
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| |style="background:LightGrey; color:black"|Purpose
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| |style="background:WhiteSmoke; color:black"|With ion beam etch the top layer of the material can be removed, to do a depth profiling
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| |style="background:LightGrey; color:black"|Ion beam size
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| |style="background:WhiteSmoke; color:black"| About 3x1 mm
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| !rowspan="2" style="background:silver; color:black" align="left"|Substrates
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| |style="background:LightGrey; color:black"|Substrate size
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| |style="background:WhiteSmoke; color:black"|
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| Maximum 60x60 mm
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| | style="background:LightGrey; color:black"|Substrate thickness
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| |style="background:WhiteSmoke; color:black"|
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| Maximum height about 20 mm
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| |-
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| |}
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| == Thermofisher sales documents == | | == Thermofisher sales documents == |
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| *[https://assets.thermofisher.com/TFS-Assets/MSD/brochures/BR52913-EN-Nexsa-XPS-Brochure.pdf Nexsa Surface Analysis System] | | *[https://assets.thermofisher.com/TFS-Assets/MSD/brochures/BR52913-EN-Nexsa-XPS-Brochure.pdf Nexsa Surface Analysis System] |
