Specific Process Knowledge/Thermal Process/Dope with Boron: Difference between revisions
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The depth profile depends of the process time. | The depth profile depends of the process time. | ||
<gallery caption="Boring profiles" widths=" | <gallery caption="Boring profiles" widths="200px" heights="200px" perrow="3"> | ||
image:borprofil_1tim.jpg|1 time | image:borprofil_1tim.jpg|1 time | ||
image:borprofil_6tim.jpg|6 time | image:borprofil_6tim.jpg|6 time | ||
image:borprofil_16tim.jpg|16 lange timer | image:borprofil_16tim.jpg|16 lange timer | ||
</gallery> | </gallery> | ||
Revision as of 15:41, 8 February 2008
Dope with boron
The furnace A2 boron predep can be used to predeposit silicon wafers with boron. The silicon wafers are positioned in a silicon carbide boat just next to wafers of boron nitride. Boron is predeposited on the silicon wafers. -Rune, hvad er det der sker?
The concentration of boron in the wafer depends on the process temperature. The depth profile depends of the process time.
- Boring profiles
1 time
6 time
16 lange timer
