Specific Process Knowledge/Direct Structure Definition: Difference between revisions

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== Comparison of equipment/material ==
== Comparison of equipment/material ==
* prøveformat/størrelse
* forudsætninger
* mønsterdannelse
* throughput
* min/max featuresize
* min/max aspect-ratio
* post-treatment
* degree of freedom


{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
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|-
|-
|-style="background:silver; color:black"
|-style="background:silver; color:black"
! '''Polymers'''
!  
![[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
![[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
![[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]
![[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]]
![[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]]
![[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]]
![[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]]
![[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool]]
![[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool]]
![[Specific Process Knowledge/Back-end processing/Disco Saw|Dicing saw]]
|-
|-


|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!General description
|Low Pressure Chemical Vapour Deposition (LPCVD furnace process)
|
|Plasma Enhanced Chemical Vapour Deposition (PECVD process)
|
|Reactive sputtering
|
|
|
|
|
|-
|-
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Allowed materials
!Allowed materials
|
|1
*Silicon
|2
*Silicon oxide
|3
*Silicon nitride
|4
*Pure quartz (fused silica)
|5
Processed wafers have to be RCA cleaned
|6
|
|-
*Silicon
 
*Silicon oxide (with boron, phosphorous and germanium)
|-
*Silicon nitrides (with boron, phosphorous and germanium)
|-style="background:WhiteSmoke; color:black"
*Pure quartz (fused silica)
!Sample sizes
|Any
|1
|
|2
|3
|4
|5
|6
|-
 
|-
|-style="background:LightGrey; color:black"
!Prerequisites
|1
|2
|3
|4
|5
|6
|-
 
|-
|-style="background:WhiteSmoke; color:black"
!Pattern generation
|1
|2
|3
|4
|5
|6
|-
 
 
|-
|-style="background:LightGrey; color:black"
!Throughput
|1
|2
|3
|4
|5
|6
|-
|-
|}


{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
|-
|-style="background:WhiteSmoke; color:black"
!Min/max featuresize
|1
|2
|3
|4
|5
|6
|-
|-


|-
|-
|-style="background:silver; color:black"
|-style="background:LightGrey; color:black"
! '''Metals/Silicon/Glass'''
!Min/max aspect-ratio
![[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
|1
![[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]]
|2
![[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]]
|3
![[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool]]
|4
|5
|6
|-
|-


|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!Post-treatment
|Low Pressure Chemical Vapour Deposition (LPCVD furnace process)
|1
|Plasma Enhanced Chemical Vapour Deposition (PECVD process)
|2
|Reactive sputtering
|3
|
|4
|5
|6
|-
|-


|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Allowed materials
!Patterning degree of freedom
|
|1
*Silicon
|2
*Silicon oxide
|3
*Silicon nitride
|4
*Pure quartz (fused silica)
|5
Processed wafers have to be RCA cleaned
|6
|
*Silicon
*Silicon oxide (with boron, phosphorous and germanium)
*Silicon nitrides (with boron, phosphorous and germanium)
*Pure quartz (fused silica)
|Any
|
|-
|-
|}
|}


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Revision as of 16:15, 6 October 2014

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Section under construction.jpg

Direct Structure Definiton

Define the structure directly on your sample

By direct structure definition we mean that you form the structures for you device directly in the material that the device consist of without any masking steps. Some of the techniques may require a master.


Choose method of structuring/equipment

Materials for structuring

Comparison of equipment/material

Nano Imprint Lithography UV Lithography 2-Photon Polymerization Lithography Polymer Injection Molder Laser Micromachining Tool Dicing saw
General description
Allowed materials 1 2 3 4 5 6
Sample sizes 1 2 3 4 5 6
Prerequisites 1 2 3 4 5 6
Pattern generation 1 2 3 4 5 6
Throughput 1 2 3 4 5 6
Min/max featuresize 1 2 3 4 5 6
Min/max aspect-ratio 1 2 3 4 5 6
Post-treatment 1 2 3 4 5 6
Patterning degree of freedom 1 2 3 4 5 6


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