Specific Process Knowledge/Direct Structure Definition: Difference between revisions

From LabAdviser
Jump to navigation Jump to search
mNo edit summary
Line 5: Line 5:


[[image:Define your structure directly.png|right|x200px|Define the structure directly on your sample]]
[[image:Define your structure directly.png|right|x200px|Define the structure directly on your sample]]
By direct structure definition we mean that you form the structures for you device directly in the material that the device consist of without any masking steps.
By direct structure definition we mean that you form the structures for you device directly in the material that the device consist of without any masking steps. Some of the techniques may require a master.


Advantages of direct structure definition may be ..
* Quicker process because no need for masking steps
* In some cases the structure is defined directly by a computer, so changes in the design can be made very quickly.
*
Dis-advantages could be
* Limited choice of materials
* Limited resolution
*
lakdfjasdfien dfjnsdk djfhk ueuhnndkjnf kjdhf jn uafhisf


== Choose method of structuring/equipment ==
== Choose method of structuring/equipment ==
Line 23: Line 13:
* [[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
* [[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
* [[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool/ablation]]
* [[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool/ablation]]
* Dicing saw
* [[Specific Process Knowledge/Back-end processing/Disco Saw|Dicing saw]]


== Materials for structuring ==
== Materials for structuring ==
Line 43: Line 33:
*Glass
*Glass
**[[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser ablation]]
**[[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser ablation]]
** dicing saw
** [[Specific Process Knowledge/Back-end processing/Disco Saw|Dicing saw]]
**[[/Sandblasting|Sandblasting (at DTU Nanotech).]]
**[[Specific Process Knowledge/Back-end processing/Sandblasting|Sandblasting (at DTU Nanotech).]]


== Comparison of equipment/material ==
== Comparison of equipment/material ==

Revision as of 14:05, 6 October 2014

Feedback to this page: click here

Section under construction.jpg

Direct Structure Definiton

Define the structure directly on your sample

By direct structure definition we mean that you form the structures for you device directly in the material that the device consist of without any masking steps. Some of the techniques may require a master.


Choose method of structuring/equipment

Materials for structuring

Comparison of equipment/material

  • prøveformat/størrelse
  • forudsætninger
  • mønsterdannelse
  • throughput
  • min/max featuresize
  • min/max aspect-ratio
  • post-treatment
  • degree of freedom
Polymers Nano Imprint Lithography 2-Photon Polymerization Lithography Polymer Injection Molder Laser Micromachining Tool
Generel description Low Pressure Chemical Vapour Deposition (LPCVD furnace process) Plasma Enhanced Chemical Vapour Deposition (PECVD process) Reactive sputtering
Allowed materials
  • Silicon
  • Silicon oxide
  • Silicon nitride
  • Pure quartz (fused silica)

Processed wafers have to be RCA cleaned

  • Silicon
  • Silicon oxide (with boron, phosphorous and germanium)
  • Silicon nitrides (with boron, phosphorous and germanium)
  • Pure quartz (fused silica)
 Any
Metals/Silicon/Glass Nano Imprint Lithography 2-Photon Polymerization Lithography Polymer Injection Molder Laser Micromachining Tool
Generel description Low Pressure Chemical Vapour Deposition (LPCVD furnace process) Plasma Enhanced Chemical Vapour Deposition (PECVD process) Reactive sputtering
Allowed materials
  • Silicon
  • Silicon oxide
  • Silicon nitride
  • Pure quartz (fused silica)

Processed wafers have to be RCA cleaned

  • Silicon
  • Silicon oxide (with boron, phosphorous and germanium)
  • Silicon nitrides (with boron, phosphorous and germanium)
  • Pure quartz (fused silica)
 Any



Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Direct_Structure_Definition&oldid=16438"