Specific Process Knowledge/Bonding: Difference between revisions
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== Choose bonding method == | == Choose bonding method == | ||
*Eutectic bonding | *[[/Eutectic bonding|Eutectic bonding]] | ||
*Fusion bonding | *Fusion bonding | ||
*Anodic bonding | *Anodic bonding | ||
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== Choose equipment == | == Choose equipment == | ||
*Speedline manual spinner - ''For spinning of PMMA and Topas'' | *Speedline manual spinner - ''For spinning of PMMA and Topas'' | ||
*EVG NIL | *EVG NIL | ||
Revision as of 14:58, 10 March 2008
Choose bonding method
- Eutectic bonding
- Fusion bonding
- Anodic bonding
Comparing the three bonding methods in the EVG NIL
| . | Eutectic bonding | Fusion bonding | Anodic bonding |
|---|---|---|---|
| General description | For bonding two substrates by use of an interphase that makes an eutecticum. | For bonding two identical materials. | For bonding Si and Glass. |
| Bonding temperature | Depending on the eutecticum 310C to 400C. | Depending on defects 50C to 400C. | Depending on the voltage 300C to 500C Standard is 400C. |
| Annnealing temperature | No annealing | 1000C in the bond furnace C3 | No annealing |
| Materials possible to bond | Bonding of substrates is done by use of the eutectica Au/Si, Au/Sn and Ni/Si | Si/Si, SiO/SiO | Si/Pyrex (glass) |
| Substrate size | Up to 6" (aligning only possible for 4" and 6") | Up to 6" (aligning only possible for 4" and 6") | Up to 6" (aligning only possible for 4" and 6") |
| Cleaning | Cleaning by N2. | Wet chemical cleaning, IMEC. | Cleaning by N2. |
Choose equipment
- Speedline manual spinner - For spinning of PMMA and Topas
- EVG NIL