Specific Process Knowledge/Back-end processing/Polishing machine

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Polisher/Lapper

The Logitech PM5 Polisher/Lapper

The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.

The user manual, user APV(s), technical information and contact information can be found in LabManager:

Equipment		Polisher/Lapper	Equipment 2
Purpose	Thinning of substrates of	InP GaAs Silicon Metals Glass/Quartz	Purpose 1 Purpose 2 Purpose 3
Performance	Thinning	Removal rate: 1-10µm/min Thickness accuracy: +/- 10 µm Thickness homogeneity: +/- 10 µm Roughness: +/- ? µm	Performance range 1 Performance range 2 Performance range 3
Performance	Polishing	Removal rate: ~1 µm/min Thickness accuracy: ? µm Thickness homogeneity: ? µm Roughness: +/- ? µm	Performance range
Process parameter range	Polishing liquid	Al2O3 (alumina) powder: 3, 9 or 20 µm Chemlox (for polishing)	Range
	Rotation speed	Thinning: 5-20 rpm Polishing: 5-80 rpm	Range
	Arm sweep	Thinning: stationary Polishing: 12% (inner) - 80% (outer)	Range
Substrates	Batch size	# small samples # 50 mm wafers # 100 mm wafers	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers
	Allowed materials	InP GaAs Silicon Metals Glass/Quartz	Allowed material 1 Allowed material 2 Allowed material 3