Specific Process Knowledge/Thin film deposition/Deposition of Silicon Nitride: Difference between revisions

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== Deposition of silicon nitride ==
Deposition of silicon nitride can be done with either LPCVD (Low Pressure Chemical Vapor Deposition) or PECVD (Plasma Enhanced Chemical Vapor Deposition). Stiochiometric nitride or silicon rich (low stress) LPCVD nitride is deposited on a batch of wafers in a LPCVD nitride furnace, and PECVD nitride (or oxynitride) is deposited on a few samples at a time in a PECVD system. LPCVD nitride has a good step coverage and a very good uniformity. Using PECVD it is possible to deposit a thicker layer of nitride on different types of samples, but the nitride does not cover sidewalls very well.


*[[/Deposition of silicon nitride using LPCVD|Nitride deposition using LPCVD]]
*[[/Deposition of silicon nitride using PECVD|Nitride deposition using PECVD]] (''or oxynitride'')
==Comparison of LPCVD and PECVD for silicon nitride deposition==
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
|-
|-
|-style="background:silver; color:black"
!
![[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|LPCVD]]
![[Specific Process Knowledge/Thin film deposition/PECVD|PECVD]]
|-
|-
|-style="background:WhiteSmoke; color:black"
!Generel description
|Low Pressure Chemical Vapour Deposition (LPCVD furnace process)
|Plasma Enhanced Chemical Vapour Deposition (PECVD process)
|-
|-
|-style="background:LightGrey; color:black"
!Stoichiometry
|
*Si<sub>3</sub>N<sub>4</sub>
*SRN (only 4" nitride furnace)
Si<sub>3</sub>N<sub>4</sub>: Stoichiometric nitride
SRN: Silicon rich (low stress) nitride
|
*Si<sub>x</sub>N<sub>y</sub>H<sub>z</sub>
*Si<sub>x</sub>O<sub>y</sub>N<sub>z</sub>H<sub>v</sub>
Silicon nitride can be doped with boron, phosphorus or germanium
|-
|-
|-style="background:WhiteSmoke; color:black"
!Film thickness
|
*Si<sub>3</sub>N<sub>4</sub>: ~50 Å - ~1400 Å
*SRN: ~50 Å - ~2800 Å
Thicker nitride layers can be deposited over more runs
|
*~40 nm - 10 µm
|-
|-
|-style="background:LightGrey; color:black"
!Process temperature
|
*780 <sup>o</sup>C - 845 <sup>o</sup>C
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*300 <sup>o</sup>C
|-
|-
|-style="background:WhiteSmoke; color:black"
!Step coverage
|
*Good
|
*Less good
|-
|-
|-style="background:LightGrey; color:black"
!Film quality
|
*Deposition on both sides og the substrate
*Dense film
*Few defects
|
*Deposition on one side of the substrate
*Less dense film
*Incorporation of hydrogen in the film
|-
|-
|-style="background:WhiteSmoke; color:black"
!KOH etch rate (80 <sup>o</sup>C)
|
*Expected <1 Å/min
|
*Dependent on recipe: ~1-10 Å/min
|-
|-
|-style="background:LightGrey; color:black"
!BHF etch rate
|
*Very low
|
*Very high compared the LPCVD nitride
|-
|-
|-style="background:WhiteSmoke; color:black"
!Batch size
|
*1-25 100 mm wafers
*1-25 150 mm wafers (only 6" furnace)
Depending on what furnace you use
|
*Several smaller samples
*1-several 50 mm wafers
*1-3 100 mm wafers
*1 150 mm wafer
Depending on what PECVD you use
|-
|-
|-style="background:LightGrey; color:black"
!'''Allowed materials'''
|
*Silicon
*Silicon oxide
*Silicon nitride
*Pure quartz (fused silica)
Processed wafers have to be RCA cleaned
|
*Silicon
*Silicon oxide (with boron, phosphorous and germanium)
*Silicon nitrides (with boron, phosphorous and germanium)
*Pure quartz (fused silica)
|-
|}
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Deposition of Silicon Nitride can be done with either LPCVD (Low Pressure Chemical Vapor Deposition) or PECVD (Plasma Enhanced Chemical Vapor Deposition).
Deposition of Silicon Nitride can be done with either LPCVD (Low Pressure Chemical Vapor Deposition) or PECVD (Plasma Enhanced Chemical Vapor Deposition).


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Revision as of 08:36, 1 February 2013

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Deposition of silicon nitride

Deposition of silicon nitride can be done with either LPCVD (Low Pressure Chemical Vapor Deposition) or PECVD (Plasma Enhanced Chemical Vapor Deposition). Stiochiometric nitride or silicon rich (low stress) LPCVD nitride is deposited on a batch of wafers in a LPCVD nitride furnace, and PECVD nitride (or oxynitride) is deposited on a few samples at a time in a PECVD system. LPCVD nitride has a good step coverage and a very good uniformity. Using PECVD it is possible to deposit a thicker layer of nitride on different types of samples, but the nitride does not cover sidewalls very well.

Comparison of LPCVD and PECVD for silicon nitride deposition

LPCVD PECVD
Generel description Low Pressure Chemical Vapour Deposition (LPCVD furnace process) Plasma Enhanced Chemical Vapour Deposition (PECVD process)
Stoichiometry
  • Si3N4
  • SRN (only 4" nitride furnace)

Si3N4: Stoichiometric nitride

SRN: Silicon rich (low stress) nitride

  • SixNyHz
  • SixOyNzHv

Silicon nitride can be doped with boron, phosphorus or germanium

Film thickness
  • Si3N4: ~50 Å - ~1400 Å
  • SRN: ~50 Å - ~2800 Å

Thicker nitride layers can be deposited over more runs

  • ~40 nm - 10 µm
Process temperature
  • 780 oC - 845 oC
  • 300 oC
Step coverage
  • Good
  • Less good
Film quality
  • Deposition on both sides og the substrate
  • Dense film
  • Few defects
  • Deposition on one side of the substrate
  • Less dense film
  • Incorporation of hydrogen in the film
KOH etch rate (80 oC)
  • Expected <1 Å/min
  • Dependent on recipe: ~1-10 Å/min
BHF etch rate
  • Very low
  • Very high compared the LPCVD nitride
Batch size
  • 1-25 100 mm wafers
  • 1-25 150 mm wafers (only 6" furnace)

Depending on what furnace you use

  • Several smaller samples
  • 1-several 50 mm wafers
  • 1-3 100 mm wafers
  • 1 150 mm wafer

Depending on what PECVD you use

Allowed materials
  • Silicon
  • Silicon oxide
  • Silicon nitride
  • Pure quartz (fused silica)

Processed wafers have to be RCA cleaned

  • Silicon
  • Silicon oxide (with boron, phosphorous and germanium)
  • Silicon nitrides (with boron, phosphorous and germanium)
  • Pure quartz (fused silica)