Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions
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[[Image: | [[Image:TPT-wirebonder.jpg|300x300px|thumb|TPT Wire Bonder, Packlab, Building 347, 2nd floor]] | ||
[[Image:TPTwirebonder_wedge_ball.jpg|300x300px|thumb|Wire bondings: Left: wedge bonding - Right: ball bonding]] | [[Image:TPTwirebonder_wedge_ball.jpg|300x300px|thumb|Wire bondings: Left: wedge bonding - Right: ball bonding]] | ||
Revision as of 13:30, 13 September 2013
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TPT Wire Bonder
The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder.
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:
Ball Wire Bonder K&S 4524
The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:
| Equipment | TPT Wire Bonder | Ball Wire Bonder | |
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