Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride: Difference between revisions
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==A few words about the furnace== | ==A few words about the furnace== | ||
The furnace is a Tempress horisontal furnace. The process is a batch process meaning you can run a batch of 25 wafers at a time. The deposition takes place at temperatures of 800-850 degrees Celsius. The LPCVD nitride has a good step coverage and the film thickness is very uniform over the wafer. We have two standard LPCVD nitride processes: One for depositing stoichiometric nitride (Si<sub>3</sub>N<sub>4</sub>) and one for deposition low stress nitride (SNR). | The furnace is a Tempress horisontal furnace. The process is a batch process meaning you can run a batch of 25 wafers at a time. The deposition takes place at temperatures of 800-850 degrees Celsius. The LPCVD nitride has a good step coverage and the film thickness is very uniform over the wafer. We have two standard LPCVD nitride processes: One for depositing stoichiometric nitride (Si<sub>3</sub>N<sub>4</sub>) and one for deposition of low stress nitride (SNR). | ||
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Revision as of 09:22, 30 November 2007
At the moment we have one LPCVD furnace for nitride depositions.
A few words about the furnace
The furnace is a Tempress horisontal furnace. The process is a batch process meaning you can run a batch of 25 wafers at a time. The deposition takes place at temperatures of 800-850 degrees Celsius. The LPCVD nitride has a good step coverage and the film thickness is very uniform over the wafer. We have two standard LPCVD nitride processes: One for depositing stoichiometric nitride (Si3N4) and one for deposition of low stress nitride (SNR).
LPCVD | |
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Stoichiometry |
SRN: Silicon Rich Nitride |
Film thickness |
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Process Temperature |
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Step coverage |
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Film quality |
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Batch size |
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Substrate material allowed |
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