Specific Process Knowledge/Lithography/Strip

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Strip Comparison Table

	Plasma Asher 3: Descum	Plasma Asher 4 (Clean)	Plasma Asher 5 (Dirty)	Resist strip	Lift-off
Purpose	Resist descum	Resist stripping Resist descum Surface treatment Other ashing of organic material	Resist stripping Resist descum Surface treatment Other ashing of organic material	Resist stripping	Metal lift-off
Method	Plasma ashing	Plasma ashing	Plasma ashing	Solvent & ultrasonication	Solvent & ultrasonication
Process gasses	O2 (50 sccm)	O2 (0-500 sccm) N2 (0-500 sccm)	O2 (0-500 sccm) N2 (0-500 sccm) CF4 (0-200 sccm)	NA	NA
Process power	10-100 W (10-100%)	150-1000 W	150-1000 W	NA	NA
Process pressure	0.8 mbar	0.5-1.5 mbar (standard process 1.3 mbar)	0.5-1.5 mbar (standard process 1.3 mbar)	NA	NA
Process solvent	NA	NA	NA	NMP (Remover 1165) IPA (rinsing agent)	NMP (Remover 1165) IPA (rinsing agent)
Process temperature	Up to ~100°C	Up to ~100°C	Up to ~100°C	Up to ~65°C	Up to ~65°C
Process time	1-10 minutes	Stripping: 20-90 minutes Descum: 5-15 minutes Surface treatment: Seconds to minutes Other ashing: Hours, material dependent	Stripping: 20-90 minutes Descum: 5-15 minutes Surface treatment: Seconds to minutes Other ashing: Hours, material dependent	NMP (Remover 1165) IPA (rinsing agent)	NMP (Remover 1165) IPA (rinsing agent)
Substrate batch	Chips: several 50 mm wafer: several 100 mm wafer: 1	Chips: several 50 mm wafer: several 100 mm wafer: 1-25 150 mm wafer: 1-25 200 mm wafer: 1-25	Chips: several 50 mm wafer: several 100 mm wafer: 1-25 150 mm wafer: 1-25 200 mm wafer: 1-25	100 mm wafer: 1-25 150 mm wafer: 1-25	100 mm wafer: 1-25 150 mm wafer: 1-25
Substrate materials	No polymer substrates Silicon substrates III-V substrates Glass substrates Films, or patterned films, of any material except type IV (Pb, Te)	No metals No metal oxides No III-V materials Silicon substrates Glass substrates Polymer substrates Films, or patterned films, of resists/polymers	Silicon substrates III-V substrates (only on Si carrier) Glass substrates Polymer substrates Films, or patterned films, of any material except type IV (Pb, Te)	No iron (Fe) containing films Silicon substrates III-V substrates Glass substrates Polymer substrates Films, or patterned films, of any material except type IV (Pb, Te)	No iron (Fe) or Copper (Cu) containing films Silicon substrates III-V substrates (only if clean) Glass substrates Films, or patterned films, of any material except type IV (Pb, Te)

Decommisioned tools

Plasma asher 1 was decommissioned 2024-12-02.

Information about decommissioned tool can be found here.

Plasma asher 2 was decommissioned 2024-12-02.

Information about decommissioned tool can be found here.