Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions
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'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Wire_Bonder#Ball_Wire_Bonder_K.26S_4524 click here]''' | '''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Wire_Bonder#Ball_Wire_Bonder_K.26S_4524 click here]''' | ||
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==TPT Wire Bonder== | ==TPT Wire Bonder== | ||
[[Image: | [[Image:bond head - wedge insert.jpg|100px|thumb|TPT wire bonder<br/>Bond head with insert showing wedge capillary]] | ||
[[Image:section under construction.jpg|70px]] ''Will be temporary taken out of service during the PolyFabLab construction.'' | |||
'''The user manual(s) | The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. It is possible to do wedge bonding with either aluminum wires or gold wires as well as gold ball bonding. | ||
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):''' | |||
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==Ball Wire Bonder K&S 4524== | ==Ball Wire Bonder K&S 4524== | ||
[[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, | <!-- copyright issue kabi | ||
[[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, 1st floor]] | |||
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[[Image:TPTwirebonder_wedge_ball.jpg|300x300px|thumb|Wire bondings: Left: wedge bonding - Right: ball bonding]] | [[Image:TPTwirebonder_wedge_ball.jpg|300x300px|thumb|Wire bondings: Left: wedge bonding - Right: ball bonding]] | ||
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[[Image:section under construction.jpg|70px]] ''Will be moved to building 451 during the PolyFabLab construction.'' | |||
The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters. | The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters. | ||
[[Image:K-S 4524 wirebonder DTU.jpg|thumb|300px|K&S 4524 ball wire bonder]] | |||
'''The user manual(s) | |||
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):''' | |||
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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=307 Ball Wire Bonder] | [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=307 Ball Wire Bonder] | ||
==Equipment performance and process related parameters== | |||
[[Image:single wire bonding.jpg|300px|thumb|Ball wire bond]] | |||
{| border="2" cellspacing="0" cellpadding="2" | {| border="2" cellspacing="0" cellpadding="2" | ||
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*Manual operation | *Manual operation | ||
*Wedge bonding: | *Wedge bonding: | ||
**recommended min. bonding area 200 µm | **recommended min. bonding area 200 µm x 200 µm | ||
*Ball bonding: | *Ball bonding: | ||
**recommended min. bonding area 200 µm | **recommended min. bonding area 200 µm x 200 µm | ||
**recommended temperature 120 <sup>o</sup>C. | **recommended temperature 120 <sup>o</sup>C. | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Semi-automatic and manual operation | *Semi-automatic and manual operation | ||
*Bond placement laser pointer | *Bond placement laser pointer | ||
*recommended min. bonding area 100 µm | *recommended min. bonding area 100 µm x 100 µm | ||
*recommended temperature 120 <sup>o</sup>C. | *recommended temperature 120 <sup>o</sup>C. | ||
|- | |- | ||
Latest revision as of 15:08, 29 June 2023
Feedback to this page: click here
Unless otherwise stated, this page is written by DTU Nanolab internal
TPT Wire Bonder
Will be temporary taken out of service during the PolyFabLab construction.
The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. It is possible to do wedge bonding with either aluminum wires or gold wires as well as gold ball bonding.
The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):
Ball Wire Bonder K&S 4524
Will be moved to building 451 during the PolyFabLab construction.
The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.
The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):
| Equipment | TPT Wire Bonder | Ball Wire Bonder | |
|---|---|---|---|
| Purpose |
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| Performance |
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| Substrates | Allowed materials |
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