Specific Process Knowledge: Difference between revisions

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<center><span style="background:Yellow">2nd Level - Process Topic</span></center>
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=== Choose the process topic you are interested in ===
=== Choose the process topic you are interested in: ===
*[[/Pattern Design|Pattern Design and Mask Fabrication]]


*[[/Back-end processing|Back-end processing]]
*[[/Back-end processing|Back-end processing]]
*[[/Bonding|Bonding]]


*[[/Characterization|Characterization]]
*[[/Characterization|Characterization]]


*[[/E-beam lithography|E-beam lithography]]
*[[/Direct Structure Definition|Direct Structure Definition]]
 
*[[/Doping|Doping]]


*[[/Etch|Etch]]
*[[/Etch|Etch]]
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*[[/Lithography|Lithography]]
*[[/Lithography|Lithography]]
<!--
*[[/Photolithography|Photolithography]]
-->


*[[/Thermal Process|Thermal Process]]
*[[/Thermal Process|Thermal Process]]
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*[[/Wafer and sample drying|Wafer and sample drying]]
*[[/Wafer and sample drying|Wafer and sample drying]]
*[[/Bonding|Wafer Bonding]]


*[[/Wafer cleaning|Wafer Cleaning]]
*[[/Wafer cleaning|Wafer Cleaning]]
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*[[/Wafer Information|Wafer Information]]
*[[/Wafer Information|Wafer Information]]


*[[/III-V Process|III-V Process]]
*[[/Overview of Fume Hoods|Overview of Fume Hoods]]
 
===The section below here is under construction [[Image:section under construction.jpg|70px]] ===


==Overview of sample processing==
*[[/Cleanroom Chemicals|List of chemicals available in the cleanroom]]
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Clean the sample [[File:cleaning.jpg|50px]]
|}
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Drying Samples [[File:drying.jpg|50px]]
|}


{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Make a layer on the sample [[File:Making a layer 1.jpg|40px]]
!
|-
|Thermal Oxide growth
|
|-
|Thin Film deposition
|
|-
|
|Sputter deposition
|-
|
|Thermal deposition
|-
|
|E-beam evaporation
|-
|CVD
|
|-
|
|LPCVD
|-
|
|PECVD
|-
|Coating
|
|-
|
|Spin coating
|-
|
|Spray coating
|-
|Electroplating
|
|-
|Epitaxial growth
|
|-
|}


{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
<!-- <HTML5video width="520" height="320" autoplay="true" loop="true">bunny</HTML5video> -->
! Thermal treatment of the sample [[File:Thermal treatment 1.jpg|50px]]
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Make a mask on the sample [[File:Making a mask 1.jpg|40px]]
|-
|Lithography
|-
|Imprinting
|-
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
!Transfer pattern into the sample
|-
|Wet etch
|-
|Dry etch
|-
|Lift-off
|-
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
!Direct structure definition
|-
|Imprinting
|-
|LASER machining
|-
|Lithographic definition
|-
|Polymer Injection molding
|-
|}
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Bonding samples together
|}
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Characterize the sample
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
!Back end of the sample
|-
|Chip/die mounting
|-
|Wire bonding
|-
|Dicing
|-
|}

Latest revision as of 14:05, 28 June 2023