Specific Process Knowledge: Difference between revisions

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<center><span style="background:Yellow">2nd Level - Process Topic</span></center>
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=== Choose the process topic you are interested in ===
=== Choose the process topic you are interested in: ===
*[[/Pattern Design|Pattern Design and Mask Fabrication]]


*[[/Back-end processing|Back-end processing]]
*[[/Back-end processing|Back-end processing]]
*[[/Bonding|Bonding]]


*[[/Characterization|Characterization]]
*[[/Characterization|Characterization]]


*[[/E-beam lithography|E-beam lithography]]
*[[/Direct Structure Definition|Direct Structure Definition]]
 
*[[/Doping|Doping]]


*[[/Etch|Etch]]
*[[/Etch|Etch]]
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*[[/Lithography|Lithography]]
*[[/Lithography|Lithography]]
<!--
*[[/Photolithography|Photolithography]]
-->


*[[/Thermal Process|Thermal Process]]
*[[/Thermal Process|Thermal Process]]
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*[[/Wafer and sample drying|Wafer and sample drying]]
*[[/Wafer and sample drying|Wafer and sample drying]]
*[[/Bonding|Wafer Bonding]]


*[[/Wafer cleaning|Wafer Cleaning]]
*[[/Wafer cleaning|Wafer Cleaning]]
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*[[/Wafer Information|Wafer Information]]
*[[/Wafer Information|Wafer Information]]


*[[/III-V Process|III-V Process]]
*[[/Overview of Fume Hoods|Overview of Fume Hoods]]


===This section is under construction [[Image:section under construction.jpg|70px]] ===
*[[/Cleanroom Chemicals|List of chemicals available in the cleanroom]]
Sample processing:
*Clean the sample
*Drying Samples
*Make a layer on the sample
**Thermal Oxide growth
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**Thin Film deposition
<!-- <HTML5video width="520" height="320" autoplay="true" loop="true">bunny</HTML5video> -->
***PVD
****Sputter deposition
****Thermal deposition
****E-beam evaporation
***CVD
****LPCVD
****PECVD
***Coating
****Spin coating
****Spray coating
****Electroplating
**Epitaxial growth
*Thermal treatment of the sample
*Make a mask on the sample
**Lithography
**Imprinting
*Transfer pattern into the sample
**Wet etch
**Dry etch
**Lift-off
*Direct structure definition
**Imprinting
**LASER machining
**Lithographic definition
**Polymer Injection molding
*Bonding samples together
*Characterize the sample
*Back end of the sample
**Chip/die mounting
**Wire bonding
**Dicing

Latest revision as of 14:05, 28 June 2023

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