Specific Process Knowledge/Thermal Process/C4 Aluminium Anneal furnace: Difference between revisions

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[[Image:C4helstak.jpg |thumb|300x300px|Aluminium Anneal furnace (C4). Positioned in cleanroom B-1]]
[[Image:C4helstak.jpg |thumb|300x300px|Aluminium Anneal furnace (C4). Positioned in cleanroom B-1]]


The Aluminium Anneal furnace (C4) is a Tempress horizontal furnace for oxidation and annealing of silicon wafers with aluminium.
The Aluminium Anneal furnace (C4) is a Tempress horizontal furnace for oxidation and annealing of silicon wafers with aluminium or ALD oxides such as Al2O3 and TiO2.


This furnace is the lowest of the furnace tubes in the furnace C-stack positioned in cleanroom B-1. In this furnace allowed to process wafers that contain aluminium. Please check the cross contamination information in LabManager before you use the furnace.  
This furnace is the lowest of the furnace tubes in the furnace C-stack positioned in cleanroom B-1. In this furnace allowed to process wafers that contain aluminium. Please check the cross contamination information in LabManager before you use the furnace.  

Revision as of 14:08, 13 March 2017

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Aluminium Anneal furnace (C4)

Aluminium Anneal furnace (C4). Positioned in cleanroom B-1

The Aluminium Anneal furnace (C4) is a Tempress horizontal furnace for oxidation and annealing of silicon wafers with aluminium or ALD oxides such as Al2O3 and TiO2.

This furnace is the lowest of the furnace tubes in the furnace C-stack positioned in cleanroom B-1. In this furnace allowed to process wafers that contain aluminium. Please check the cross contamination information in LabManager before you use the furnace.

The user manual, technical information and contact information can be found in LabManager:

Aluminium Anneal furnace (C4)

Process knowledge

Overview of the performance of Aluminium Anneal furnace and some process related parameters

Purpose
  • Annealing of wafers with aluminium
  • Oxidation of wafers with aluminium
Process parameter range Process Temperature
  • 400-500 oC
Process pressure
  • 1 atm
Gas flows
  • N2: 0-10 slm
  • O2: 0-10 slm
Substrates Batch size
  • 1-30 100 mm wafers (or 50 mm wafers)
Substrate materials allowed
  • Silicon wafers with aluminium.
  • Wafers are allowed enter the furnace after aluminium lift-off or after aluminium etch and resist strip in acetone