Specific Process Knowledge/Back-end processing/Polisher CMP - Revision history

Mmat at 17:06, 27 May 2025

2025-05-27T17:06:06Z

← Older revision		Revision as of 19:06, 27 May 2025
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	'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Polisher_CMP click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Polisher_CMP click here]'''
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	== Polisher (CMP) ==		== Polisher (CMP) ==

2025-05-27T17:05:57Z

← Older revision		Revision as of 19:05, 27 May 2025
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	~~'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''~~		{{cc-nanolab}}

	~~'''All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.'''~~

2023-02-06T14:21:55Z

← Older revision		Revision as of 16:21, 6 February 2023
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			'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''

			'''All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.'''


	'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Polisher_CMP click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Polisher_CMP click here]'''

2020-04-21T07:14:08Z

Polisher (CMP)

← Older revision		Revision as of 09:14, 21 April 2020
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	[[image:Cmp_picture.jpg\|400px\|right\|thumb\|The Logitech PM5 Polisher/Lapper in cleanroom A-5]]		[[image:Cmp_picture.jpg\|400px\|right\|thumb\|The Logitech PM5 Polisher/Lapper in cleanroom A-5]]

	The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates.		The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates. After CMP it is recommended to use the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/Post_CMP_Cleaner Post CMP Cleaner]''' to clean the sample for slurry residues left by the CMP.

2019-02-01T10:48:23Z

Polisher (CMP)

← Older revision		Revision as of 12:48, 1 February 2019
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	== Polisher (CMP) ==		== Polisher (CMP) ==

	[[image:Cmp_picture.jpg\|400px\|right\|thumb\|The Logitech PM5 Polisher/Lapper]]		[[image:Cmp_picture.jpg\|400px\|right\|thumb\|The Logitech PM5 Polisher/Lapper in cleanroom A-5]]

	The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates.		The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates.

2018-11-29T09:38:25Z

Polisher (CMP)

← Older revision		Revision as of 11:38, 29 November 2018
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	<!-- give the link to the equipment info page in LabManager: -->		<!-- give the link to the equipment info page in LabManager: -->
	[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=430 The Logitech Orbis (CMP) in LabManager]		[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=430 The Logitech Orbis (CMP) in LabManager]


	==Equipment performance and process related parameters==		==Equipment performance and process related parameters==

2018-11-29T09:35:05Z

Equipment performance and process related parameters

← Older revision		Revision as of 11:35, 29 November 2018
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	\|-		\|-
	!style="background:silver; color:black" align="center" valign="center" rowspan="2"\|Performance		!style="background:silver; color:black" align="center" valign="center" rowspan="2"\|Performance
	\|style="background:LightGrey; color:black"\| ~~Thinning~~		\|style="background:LightGrey; color:black"\| 20x20mm substrate
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Removal rate: ~~1-10µm~~/min		*Removal rate: 400nm/min
	*Thickness accuracy: +/- 10 µm		*Thickness accuracy: +/- ? µm
	*Thickness homogeneity: +/- 10 µm		*Thickness homogeneity: +/- ? µm
	*Roughness: +/- ? µm		*Roughness: +/- ? µm
	<!-- \|style="background:WhiteSmoke; color:black"\|		<!-- \|style="background:WhiteSmoke; color:black"\|
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	*Performance range 3 -->		*Performance range 3 -->
	\|-		\|-
	\|style="background:LightGrey; color:black"\|~~Polishing~~		\|style="background:LightGrey; color:black"\|100mm substrate
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Removal rate: ~~~1 µm~~/min		*Removal rate: ~ 60 nm/min
	*Thickness accuracy: ? µm		*Thickness accuracy: ? µm
	*Thickness homogeneity: ? µm		*Thickness homogeneity: ? µm

2018-11-29T09:32:31Z

Equipment performance and process related parameters

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	!style="background:silver; color:black;" align="center" width="60"\|Purpose		!style="background:silver; color:black;" align="center" width="60"\|Purpose
	\|style="background:LightGrey; color:black"\|		\|style="background:LightGrey; color:black"\|
	~~Thinning of substrates~~ of		Polishing of
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*InP
	*GaAs
	*Silicon		*Silicon
	*~~Metals~~		*SiO2
	*Glass/Quartz
	<!-- \|style="background:WhiteSmoke; color:black"\|		<!-- \|style="background:WhiteSmoke; color:black"\|
	*Purpose 1		*Purpose 1

2018-11-29T09:31:25Z

Equipment performance and process related parameters

← Older revision		Revision as of 11:31, 29 November 2018
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	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Plate		*Plate
	*~~HeadPpuck~~\|-		*Head/Puck
			\|-
	\|style="background:LightGrey; color:black"\|Arm sweep		\|style="background:LightGrey; color:black"\|Arm sweep
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|

2018-11-29T09:29:49Z

Equipment performance and process related parameters

← Older revision		Revision as of 11:29, 29 November 2018
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	*Chemcloth Polishing Cloths		*Chemcloth Polishing Cloths
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Rotation ~~speed~~		\|style="background:LightGrey; color:black"\|Rotation
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*~~Thinning: 5-20 rpm~~		*Plate
	*~~Polishing: 5-80 rpm~~		*HeadPpuck\|-
	\|-
	\|style="background:LightGrey; color:black"\|Arm sweep		\|style="background:LightGrey; color:black"\|Arm sweep
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|